Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

ABSTRACT

Chips are stacked and mounted on a circuit board having external connection electrodes and mounted thereon by wire bonding. At least one of the chips stacked on the chip includes overhung portions each of which has a start point inside bonding pads, is made thinner in a direction towards the outer periphery to an end point reaching the side wall and forms a space used to accommodate ball bonding portions between the overhung portion and the main surface of the chip arranged in the lower stage on a backside corresponding in position to the bonding pads, and insulating members formed to cover the overhung portions and prevent bonding wires of the chip arranged in the lower stage from being brought into contact with the upper-stage chip.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of application Ser. No. 11/344,063, filedFeb. 1, 2006, which now U.S. Pat. No. 7,675,153 is based upon and claimsthe benefit of priority from prior Japanese Patent Applications No.2005-026698, filed Feb. 2, 2005; and No. 2005-026699, filed Feb. 2,2005. The contents of the above-listed applications are incorporatedherein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a semiconductor device having semiconductorchips stacked and mounted thereon and a manufacturing method thereof.More specifically, this invention relates to a package typesemiconductor device of next generation called a COC (Chip On Chip) anda manufacturing method thereof and a semiconductor device called astacked MCP (Multi-Chip Package) having the stacked and mountedsemiconductor chips sealed in one package and a manufacturing methodthereof.

2. Description of the Related Art

A stacked MCP in which the chip thickness and the package thickness arereduced is described in Jpn. Pat. Appln. KOAKAI Publication No.H10-70232, for example. This type of semiconductor device is formed bythe following process. First, the backside of a semiconductor waferwhich has been subjected to an element forming process is ground andetched and the wafer is reduced to desired thickness. Next, a DAF (Dieattach film) or bonding agent such as epoxy resin is affixed to thebackside of the semiconductor wafer and then the wafer is diced and cutapart into individual semiconductor chips. After this, the semiconductorchip is mounted on a printed circuit board or the like. Next, thesemiconductor chip is electrically connected to printed wirings on thecircuit board by wire bonding. Another semiconductor chip is stacked andmounted on the above semiconductor chip with a DAF disposed therebetweenand the semiconductor chip is electrically connected to printed wiringson the circuit board by wire bonding. After this, the same process isrepeatedly performed to sequentially stack semiconductor chips and awire bonding process is performed for each chip. Then, the semiconductorchips stacked and mounted on the circuit board are sealed into a packageof resin or the like.

When semiconductor chips with the same size are stacked on one anotheror a semiconductor chip larger than the semiconductor chip of the lowerstage is stacked thereon, a spacer is affixed to the semiconductor chipof the lower stage with a DAF disposed therebetween in order to preventthe bonding wire from being brought into contact with the backside ofthe semiconductor chip of the upper stage. The spacer is smaller in sizethan the semiconductor chip of the lower stage, the outer peripheralportion thereof is set inside the bonding pads of the semiconductor chipof the lower stage and the spacer has thickness to provide a space whichprevents the bonding wire of the chip of the lower stage from beingbrought into contact with the semiconductor chip of the upper stage whenthe semiconductor chip of the upper stage is mounted. Then, thesemiconductor chip of the upper stage is mounted on the spacer with theDAF disposed therebetween and the bonding pads are electricallyconnected to the circuit board by wire bonding.

However, with the above structure and manufacturing method, thefollowing problems (1) to (6) are provided.

(1) If the semiconductor wafer is diced with the DAF affixed thereonafter the backside of the semiconductor wafer is ground, etched or thelike to reduce the thickness thereof to desired thickness, chippings orcracks often occur on the backside of the chip.

(2) If the thickness of the semiconductor wafer is set to 70 μm or less,breakage of the wafer tends to occur and it becomes difficult to dealwith the wafer. Further, since nothing is formed on the backside of thesemiconductor chip while a protection film and wiring pattern are formedon the main surface thereof, a warp occurs due to a difference in thethermal expansion coefficient and the warp amount becomes severalmillimeters when the thickness is set to 30 μm. Therefore, it is notonly difficult to deal with the chip, but also a recognition erroroccurs at the time of position detection by using an optical system suchas a TV camera performed when the chip is stacked and mounted.

(3) Chip cracks often occur when individual semiconductor chips arepicked up (separated) from a dicing tape after the semiconductor waferis divided into the discrete chips. Further, when the thickness of thesemiconductor chip becomes less than 100 μm, deflection (bending) occursin the semiconductor chip when it is attracted by a collet and voidsoccur in the die-bonding (adhesion and pressure-connection) process.

(4) The semiconductor chip of the second stage or succeeding state isbent by pressurization at the ball bonding time because no rigidmaterial is present under the bonding pad and the chip itself is thinand a lowering in the bonding property, for example, a loose connectionand faulty connection position tend to occur. Further, if the bendingamount of the chip is further increased, wire deformation and chipcracks occur in the semiconductor chip of the lower layer.

(5) When the semiconductor chips of the same size are stacked or thesemiconductor chips of different sizes including a chip of the upperstage larger than the chip of the lower stage are stacked in the secondand succeeding stages, it is necessary to dispose a spacer and DAFbetween the semiconductor chips and the package thickness cannot be madesufficiently small even if the semiconductor chip is made sufficientlythin. If the spacer and DAF are made thin, a short circuit or leak tendsto occur between the bonding wire and the backside of the semiconductorchip stacked in the upper stage. Further, there occurs a possibilitythat the bonding wire flows to cause a short circuit at the time ofresin-sealing.

(6) Costs for fabricating and bonding processes are necessary inaddition to a material cost for the spacer and DAF, and as a result, thecost increases and the productivity is lowered.

The COC package type semiconductor device is described in Jpn. Pat.Appln. KOKAI Publication No. H05-063137 and Jpn. Pat. Appln. KOKAIPublication No. 06-120419. The semiconductor device of the above type isformed by the following process. First, semiconductor elements areformed on the main surface of a semiconductor wafer. Further, throughelectrodes electrically connected to the semiconductor elements areformed for the respective semiconductor chips. Next, the backside of thesemiconductor wafer is ground and etched and the thickness of the waferis reduced to desired thickness. After this, the backside of thesemiconductor wafer is subjected to a CMP, plasma etching process andthe like to cause the through electrodes to protrude. Next, a dicingprocess is performed to divide the wafer into discrete semiconductorchips. Then, the semiconductor chips formed by the above process arestacked and mounted in a multistage form on a printed circuit boardhaving external connection electrodes. At this time, the throughelectrodes of the stacked semiconductor chips are electrically connectedto one another via connection electrodes such as ball bumps or studbumps inserted therebetween. After this, they are sealed into a packageof resin or the like.

However, the above structure and manufacturing method have the followingproblems (7) to (10).

(7) If the semiconductor wafer is diced after the backside of thesemiconductor wafer is ground and etched and the thickness of the waferis reduced to desired thickness, chippings and cracks often occur on thebackside of the chip.

(8) If the thickness of the semiconductor wafer is set to 70 μm or less,breakage tends to occur and it is difficult to deal with the wafer.Further, since nothing is formed on the backside of the semiconductorchip while a protection film and wiring pattern are formed on the mainsurface thereof, a warp occurs due to a difference in the thermalexpansion coefficient and the warp amount becomes several millimeterswhen the thickness of the chip is set to 30 μm. Therefore, it is notonly difficult to deal with the chip, but also a recognition erroroccurs at the time of position detection performed by using an opticalsystem such as a TV camera when the chip is stacked and mounted.

(9) Chip cracks often occur when individual semiconductor chips arepicked up (separated) from a dicing tape after the semiconductor waferis divided into the discrete chips. Further, when the thickness of thesemiconductor chip becomes less than 100 μm, deflection (bending) occursin the semiconductor chip when it is attracted by a collet and voidsoccur in the die bonding process.

(10) When the semiconductor chips are stacked in a multistage form andmounted on a printed circuit board, the thicknesses of the connectionelectrodes of the respective chips are required in addition to the totalsum of the thicknesses of the semiconductor chips to prevent a reductionin the thickness of the package.

BRIEF SUMMARY OF THE INVENTION

A semiconductor device according to an aspect of this inventioncomprises a plurality of semiconductor chips which are stacked andmounted on a circuit board having external connection electrodes andeach of which is mounted on the circuit board by means of wire bonding,wherein at least one semiconductor chip stacked on the semiconductorchip includes bonding pads which are arranged on a main surface of thesemiconductor chip along at least one side thereof and electricallyconnected to semiconductor elements, overhung portions formed inpositions of a backside of the semiconductor chip corresponding to thebonding pads, having a start point inside the bonding pads, formed tobecome thinner in a direction toward an outer periphery to an end pointwhich reaches a side wall thereof, and forming spaces to accommodateball bonding portions between the overhung portions and a main surfaceof a semiconductor chip arranged in a lower stage, and insulating layerswhich are formed to cover the overhung portions and prevent the chipfrom being brought into contact with bonding wires of the semiconductorchip arranged in the lower stage.

A manufacturing method of a semiconductor device according to anotheraspect of this invention comprises forming semiconductor elements andbonding pads electrically connected to the semiconductor elements on amain surface of a semiconductor wafer, forming grooves having openingportions wider than regions between the bonding pads of adjacentsemiconductor chips on a backside in positions corresponding to thebonding pads between the adjacent semiconductor chips along one ofdicing lines and chip dividing lines of the semiconductor wafer, forminginsulating layers in the grooves, dividing the semiconductor wafer alongone of the dicing lines and chip dividing lines of the semiconductorwafer to form semiconductor chips having overhung portions each formedto have a start point inside the bonding pads and become thinner in adirection toward an outer periphery to an end point which reaches a sidewall thereof and used to form spaces which accommodate ball bondingportions between the overhung portions and a main surface of asemiconductor chip arranged in a lower stage by using the inner walls ofthe grooves on at least one side of the outer periphery, and stackingand mounting a plurality of semiconductor chips including thesemiconductor chip having the overhung portions formed with the overhungportions set to correspond in position to the ball bonding portions ofthe semiconductor chip arranged in a lower stage and connecting bondingpads formed on a main surface of each semiconductor chip to printedwirings on the circuit board by wire bonding each time the semiconductorchip is mounted.

A semiconductor device according to still another aspect of thisinvention comprises a plurality of semiconductor chips mounted on acircuit board having external connection electrodes, wherein thesemiconductor chips are mounted on the circuit board via connectionelectrodes, and at least one of the semiconductor chips includes throughelectrodes formed in through holes which penetrate through thesemiconductor chip with insulating films disposed therebetween andelectrically connected to semiconductor elements, and overhung portionsor grooves formed in positions corresponding to the through electrodeson a backside of the semiconductor chip and forming accommodatingportions which accommodate the connection electrodes between theoverhung portions or grooves and the circuit board or a main surface ofthe semiconductor chip arranged in a lower stage.

A manufacturing method of a semiconductor device according to anotheraspect of this invention comprises forming semiconductor elements andthrough electrodes electrically connected to the semiconductor elementson a main surface of a semiconductor wafer, forming grooves havingopening portions wider than the through electrodes in positionscorresponding to the through electrodes on a backside of thesemiconductor wafer, dividing the semiconductor wafer along one ofdicing lines and chip dividing lines of the semiconductor wafer to formsemiconductor chips each having overhung portions or grooves which formaccommodating portions to accommodate connection electrodes between theoverhung portions or grooves and a chip mounting surface of a circuitboard having external connection electrodes or a main surface of asemiconductor chip arranged in a lower stage, and mounting the pluralityof semiconductor chips thus formed by arranging the overhung portions orgrooves of the plurality of semiconductor chips to face electrode padsof the circuit board or the through electrodes of the semiconductor chiparranged in the lower stage and making electrical connections betweenthe electrode pads and the through electrodes of the semiconductor chipsand between the through electrodes of the semiconductor chips via theconnection electrodes.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a cross sectional view showing an example of a stack MCPhaving three semiconductor chips with the same size stacked, forillustrating a semiconductor device according to a first embodiment ofthis invention;

FIG. 2 is a view schematically showing a cross section of thesecond-stage semiconductor chip of the stack MCP shown in FIG. 1;

FIG. 3 is an enlarged cross sectional view showing a portion near ballbonding portions of the first-stage and second-stage semiconductor chipsof the stack MCP shown in FIG. 1;

FIG. 4A to FIG. 11A are perspective views respectively showing first toeighth steps, for illustrating a manufacturing method of the COC packagetype semiconductor device shown in FIG. 1;

FIG. 4B to FIG. 11B are cross sectional views of FIG. 4A to FIG. 11A,for illustrating the manufacturing method of the COC package typesemiconductor device shown in FIG. 1;

FIG. 12A is a plan view of a semiconductor wafer, for illustrating theforming position of second grooves;

FIG. 12B is a perspective view of a semiconductor chip, for illustratingthe forming position of the second grooves;

FIG. 13 is an enlarged cross sectional view of a groove forming region,for illustrating a second groove forming step;

FIG. 14 is an enlarged cross sectional view of a portion near the tipportion of a blade used to form the second grooves;

FIG. 15 is an enlarged cross sectional view of a portion near the tipportion, for illustrating another example of a blade used to form thesecond grooves;

FIG. 16 is an enlarged cross sectional view of overhung portions formedby the second groove;

FIG. 17 is an enlarged cross sectional view for illustrating anotherconfiguration example of overhung portions formed by the second groove;

FIG. 18 is an enlarged cross sectional view of a portion near a pickupneedle in a pickup device, for illustrating a pickup step;

FIG. 19A is a perspective view of the entire structure, for illustratinga wire bonding step;

FIG. 19B is a cross sectional view of FIG. 19A, for illustrating thewire bonding step;

FIG. 19C is an enlarged cross sectional view of a portion near the ballbonding portion, for illustrating the wire bonding step;

FIG. 20 is a diagram showing the simulation result of the bending of achip at the ball bonding time and showing the relation between thethickness of the chip and the bending amount when the overhung portionis present and omitted and the shape of the overhung portion is changed;

FIG. 21A is a cross sectional view of a semiconductor chip, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 21B is an enlarged cross sectional view of an overhung portion, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 22A is a cross sectional view of a semiconductor chip, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 22B is an enlarged cross sectional view of an overhung portion, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 23 is an enlarged cross sectional view of a portion near the tipportion of a blade, for illustrating still another example of the bladeused to form the second grooves;

FIG. 24 is an enlarged cross sectional view of a groove forming region,for illustrating another forming step of the second grooves;

FIG. 25 is a photomicrograph of the overhung portion in thesemiconductor chip having the overhung portion formed in the step shownin FIG. 24;

FIG. 26 is a photomicrograph of the overhung portion in anothersemiconductor chip having the overhung portion formed in the step shownin FIG. 24;

FIG. 27 is a photomicrograph of a state in which semiconductor chipshaving overhung portions with various sizes formed are stacked;

FIG. 28 is a photomicrograph of a state in which other semiconductorchips having overhung portions with various sizes formed are stacked;

FIG. 29A is a cross sectional view of a semiconductor chip, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 29B is an enlarged cross sectional view of an overhung portion, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 30A is a cross sectional view of a semiconductor chip, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 30B is an enlarged cross sectional view of an overhung portion, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 31 is an enlarged cross sectional view of a portion near the tipportion, for illustrating still another example of the blade used toform the second grooves;

FIG. 32 is an enlarged cross sectional view of a portion near the tipend portion, for illustrating still another example of the blade used toform the second grooves;

FIG. 33A is a plan view of a semiconductor wafer, for illustratinganother forming position of the second grooves;

FIG. 33B is a perspective view of a semiconductor chip, for illustratinganother forming position of the second grooves;

FIG. 34A is a plan view of a semiconductor wafer, for illustrating stillanother forming position of the second grooves;

FIG. 34B is a perspective view of a semiconductor chip, for illustratingstill another forming position of the second grooves;

FIG. 35 is a cross sectional view showing a modification 1 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 36 is a cross sectional view showing a modification 2 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 37 is a cross sectional view showing a modification 3 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 38 is a cross sectional view showing a modification 4 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 39 is a cross sectional view showing a modification 5 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 40 is a cross sectional view showing a modification 6 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 41 is a cross sectional view showing a modification 7 of thestacked structure of semiconductor chips in the stack MCP, forillustrating a semiconductor device according to another embodiment ofthis invention;

FIG. 42A to FIG. 50A are perspective views respectively showing first toninth manufacturing steps, for illustrating another manufacturingprocess (modification 1) of the stack MCP;

FIG. 42B to FIG. 50B are cross sectional views of FIGS. 42A to 50A, forillustrating another manufacturing process (modification 1) of the stackMCP;

FIG. 51A to FIG. 58A are perspective views respectively showing first toeighth manufacturing steps, for illustrating another manufacturingprocess (modification 2) of the stack MCP;

FIG. 51B to FIG. 58B are cross sectional views of FIGS. 51A to 58A, forillustrating another manufacturing process (modification 2) of the stackMCP;

FIG. 59A to FIG. 67A are perspective views respectively showing first toninth manufacturing steps, for illustrating another manufacturingprocess (modification 3) of the stack MCP;

FIG. 59B to FIG. 67B are cross sectional views of FIGS. 59A to 67A, forillustrating another manufacturing process (modification 3) of the stackMCP;

FIG. 68A to FIG. 76A are perspective views respectively showing first toninth manufacturing steps, for illustrating another manufacturingprocess (modification 4) of the stack MCP;

FIG. 68B to FIG. 76B are cross sectional views of FIGS. 68A to 76A, forillustrating another manufacturing process (modification 4) of the stackMCP;

FIG. 77A to FIG. 85A are perspective views respectively showing first toninth manufacturing steps, for illustrating another manufacturingprocess (modification 5) of the stack MCP;

FIG. 77B to FIG. 85B are cross sectional views of FIGS. 77A to 85A, forillustrating another manufacturing process (modification 5) of the stackMCP;

FIG. 86A to FIG. 92A are perspective views respectively showing first toseventh manufacturing steps, for illustrating another manufacturingprocess (modification 6) of the stack MCP;

FIG. 86B to FIG. 92B are cross sectional views of FIGS. 86A to 92A, forillustrating another manufacturing process (modification 6) of the stackMCP;

FIG. 93A to FIG. 100A are perspective views respectively showing firstto eighth manufacturing steps, for illustrating another manufacturingprocess (modification 7) of the stack MCP;

FIG. 93B to FIG. 100B are cross sectional views of FIGS. 93A to 100A,for illustrating another manufacturing process (modification 7) of thestack MCP;

FIG. 101A to FIG. 107A are perspective views respectively showing firstto seventh manufacturing steps, for illustrating another manufacturingprocess (modification 8) of the stack MCP;

FIG. 101B to FIG. 107B are cross sectional views of FIGS. 101A to 107A,for illustrating another manufacturing process (modification 8) of thestack MCP;

FIG. 108A to FIG. 116A are perspective views respectively showing firstto ninth manufacturing steps, for illustrating another manufacturingprocess (modification 9) of the stack MCP;

FIG. 108B to FIG. 116B are cross sectional views of FIGS. 108A to 116A,for illustrating another manufacturing process (modification 9) of thestack MCP;

FIG. 117A is a perspective view showing a step example 1 of fixing andsealing the ball bonding portion shown in FIGS. 107A, 107B, 116A, 116Bby use of an insulating member;

FIG. 117B is a cross sectional view of FIG. 117A showing the stepexample 1 of fixing and sealing the ball bonding portion shown in FIGS.107A, 107B, 116A, 116B by use of the insulating member;

FIG. 118A is a perspective view showing a step example 2 of fixing andsealing the ball bonding portion shown in FIGS. 107A, 107B, 116A, 116Bby use of an insulating member;

FIG. 118B is a cross sectional view of FIG. 118A showing the stepexample 1 of fixing and sealing the ball bonding portion shown in FIGS.107A, 107B, 116A, 116B by use of the insulating member;

FIG. 119A is a perspective view showing a step example 3 of fixing andsealing the ball bonding portion shown in FIGS. 107A, 107B, 116A, 116Bby use of an insulating member;

FIG. 119B is a cross sectional view of FIG. 119A showing the stepexample 3 of fixing and sealing the ball bonding portion shown in FIGS.107A, 107B, 116A, 116B by use of the insulating member;

FIG. 120A is a perspective view showing a step example 4 of fixing andsealing the ball bonding portion shown in FIGS. 107A, 107B, 116A, 116Bby use of an insulating member;

FIG. 120B is a cross sectional view of FIG. 120A showing the stepexample 4 of fixing and sealing the ball bonding portion shown in FIGS.107A, 107B, 116A, 116B by use of the insulating member;

FIG. 121A is a perspective view showing a step example 5 of fixing andsealing the ball bonding portion shown in FIGS. 107A, 107B, 116A, 116Bby use of an insulating member;

FIG. 121B is a cross sectional view of FIG. 121A showing the stepexample 5 of fixing and sealing the ball bonding portion shown in FIGS.107A, 107B, 116A, 116B by use of the insulating member;

FIG. 122 is a photomicrograph obtained when a plurality of semiconductorchips having overhung portions formed therein are stacked, the spacesare filled with insulating members and resin is used as the insulatingmember;

FIG. 123 is a photomicrograph obtained when a plurality of semiconductorchips having overhung portions formed therein are stacked, the spacesare filled with insulating members and insulating paste is used as theinsulating member;

FIG. 124 is a cross sectional view showing an example of a COC packagetype semiconductor device having three semiconductor chips with the samesize stacked, for illustrating a semiconductor device according to asecond embodiment of this invention;

FIG. 125 is a view schematically showing a cross section of thesemiconductor chip shown in FIG. 124;

FIG. 126 is an enlarged cross sectional view showing a portion nearthrough electrodes and stud bump portions of the first-stage andsecond-stage semiconductor chips shown in FIG. 124;

FIG. 127A to FIG. 134A are perspective views respectively showing firstto eighth steps, for illustrating a manufacturing method of the COCpackage type semiconductor device shown in FIG. 124;

FIG. 127B to FIG. 134B are cross sectional views of FIG. 127A to FIG.134A, for illustrating the manufacturing method of the COC package typesemiconductor device shown in FIG. 124;

FIG. 135A is a plan view of a semiconductor wafer, for illustrating theforming position of second grooves;

FIG. 135B is a perspective view of a semiconductor chip, forillustrating the forming position of the second grooves;

FIG. 136 is an enlarged cross sectional view of a groove forming region,for illustrating a second groove forming step;

FIG. 137A is a cross sectional view of a semiconductor chip, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 137B is an enlarged cross sectional view of an overhung portion,for illustrating another example of the overhung shape of thesemiconductor chip;

FIG. 138A is a cross sectional view of a semiconductor chip, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 138B is an enlarged cross sectional view of an overhung portion,for illustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 139 is an enlarged cross sectional view of a groove forming region,for illustrating another forming step of the second grooves;

FIG. 140A is a cross sectional view of a semiconductor chip, forillustrating another example of the overhung shape of the semiconductorchip;

FIG. 140B is an enlarged cross sectional view of an overhung portion,for illustrating another example of the overhung shape of thesemiconductor chip;

FIG. 141A is a cross sectional view of a semiconductor chip, forillustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 141B is an enlarged cross sectional view of an overhung portion,for illustrating still another example of the overhung shape of thesemiconductor chip;

FIG. 142A is a plan view of a semiconductor wafer, for illustratinganother forming position of second grooves;

FIG. 142B is a perspective view of a semiconductor chip, forillustrating another forming position of the second grooves;

FIG. 143A is a plan view of a semiconductor wafer, for illustratingstill another forming position of second grooves;

FIG. 143B is a perspective view of a semiconductor chip, forillustrating still another forming position of the second grooves;

FIG. 144A is a plan view of a semiconductor wafer, for illustratinganother forming position of second grooves;

FIG. 144B is a perspective view of a semiconductor chip, forillustrating another forming position of the second grooves;

FIG. 145A is a plan view of a semiconductor wafer, for illustratingstill another forming position of second grooves;

FIG. 145B is a perspective view of a semiconductor chip, forillustrating still another forming position of the second grooves;

FIG. 146A is a plan view of a semiconductor wafer, for illustratinganother forming position of second grooves;

FIG. 146B is a perspective view of a semiconductor chip, forillustrating another forming position of the second grooves;

FIG. 147A is a plan view of a semiconductor wafer, for illustratingstill another forming position of second grooves;

FIG. 147B is a perspective view of a semiconductor chip, forillustrating still another forming position of the second grooves;

FIG. 148 is a cross sectional view showing a modification 1 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 149 is a cross sectional view showing a modification 2 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 150 is a cross sectional view showing a modification 3 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 151 is a cross sectional view showing a modification 4 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 152 is a cross sectional view showing a modification 5 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 153 is a cross sectional view showing a modification 6 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 154 is a cross sectional view showing a modification 7 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 155 is a cross sectional view showing a modification 8 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 156 is a cross sectional view showing a modification 9 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 157 is a cross sectional view showing a modification 10 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 158 is a cross sectional view showing a modification 11 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 159 is a cross sectional view showing a modification 12 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 160 is a cross sectional view showing a modification 13 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 161 is a cross sectional view showing a modification 14 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 162 is a cross sectional view showing a modification 15 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 163 is a cross sectional view showing a modification 16 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 164 is a cross sectional view showing a modification 17 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 165 is a cross sectional view showing a modification 18 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 166 is a cross sectional view showing a modification 19 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 167 is a cross sectional view showing a modification 20 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 168 is a cross sectional view showing a modification 21 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 169 is a cross sectional view showing a modification 22 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 170 is a cross sectional view showing a modification 23 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 171 is a cross sectional view showing a modification 24 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 172 is a cross sectional view showing a modification 25 of thestacked structure of semiconductor chips in a COC package typesemiconductor device, for illustrating a semiconductor device accordingto another embodiment of this invention;

FIG. 173A to FIG. 179A are perspective views respectively showing firstto seventh manufacturing steps, for illustrating another manufacturingprocess (modification 1) of a COC package type semiconductor device;

FIG. 173B to FIG. 179B are cross sectional views of FIG. 173A to FIG.178A, for illustrating the other manufacturing process (modification 1)of the COC package type semiconductor device;

FIG. 180A to FIG. 187A are perspective views respectively showing firstto eighth manufacturing steps, for illustrating another manufacturingprocess (modification 2) of a COC package type semiconductor device;

FIG. 180B to FIG. 187B are cross sectional views of FIG. 180A to FIG.187A, for illustrating the other manufacturing process (modification 2)of the COC package type semiconductor device;

FIG. 188A to FIG. 195A are perspective views respectively showing firstto seventh manufacturing steps, for illustrating another manufacturingprocess (modification 3) of a COC package type semiconductor device;

FIG. 188B to FIG. 195B are cross sectional views of FIG. 188A to FIG.195A, for illustrating the other manufacturing process (modification 3)of the COC package type semiconductor device;

FIG. 196A is a perspective view showing a step example 1 of embeddingspaces with insulating members;

FIG. 196B is a cross sectional view of FIG. 196A, for illustrating thestep example 1 of embedding the spaces with the insulating members;

FIG. 197A is a perspective view showing a step example 2 of embeddingspaces with insulating members;

FIG. 197B is a cross sectional view of FIG. 197A, for illustrating thestep example 2 of embedding the spaces with the insulating members;

FIG. 198A is a perspective view showing a step example 3 of embeddingspaces with insulating members;

FIG. 198B is a cross sectional view of FIG. 198A, for illustrating thestep example 3 of embedding the spaces with the insulating members;

FIG. 199A is a perspective view showing a step example 4 of embeddingspaces with insulating members;

FIG. 199B is a cross sectional view of FIG. 199A, for illustrating thestep example 4 of embedding the spaces with the insulating members;

FIG. 200A is a perspective view when viewing a chip stacked in an upperstage from the backside thereof, for illustrating a step example 5 ofembedding spaces with insulating members; and

FIG. 200B is a cross sectional view of the mounting step, forillustrating the step example 5 of embedding the spaces with theinsulating members.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

FIG. 1 is a cross sectional view showing a semiconductor deviceaccording to a first embodiment of this invention. In this case, a stackMCP having three semiconductor chips with the same size stacked is dealtwith as an example. That is, three semiconductor chips 12-1, 12-2, 12-3with the same size are stacked and mounted on a printed circuit board(PCB) 11 with DAFs 13-1, 13-2, 13-3 disposed therebetween, respectively.For example, the circuit board 11 has a multi-layered wiring structure.Wirings to which bonding wires are connected are formed on the chipmounting surface of the circuit board 11 and external connectionelectrodes (external terminals) 14-1, 14-2, 14-3, . . . such as ballbumps (solder balls) and pins are arranged in an array form on thebackside thereof to form a so-called ball grid array or pin grid array.

Bonding pads 15-1, 15-2, 15-3 formed on the main surfaces of thesemiconductor chips 12-1, 12-2, 12-3 and the printed wirings formed onthe chip mounting surface of the circuit board 11 are connected togethervia bonding wires 16-1, 16-2, 16-3, respectively. The bonding pads 15-1,15-2, 15-3 are electrically connected to semiconductor elements formedon the main surfaces of the respective semiconductor chips 12-1, 12-2,12-3. The printed wirings formed on the chip mounting surface of thecircuit board 11 are connected to the external connection electrodes14-1, 14-2, 14-3, . . . via a multi-layered wiring structure formed inthe circuit board 11. Thus, the semiconductor chips 12-1, 12-2, 12-3 andthe external connection electrodes 14-1, 14-2, 14-3, . . . areelectrically connected.

The first-stage semiconductor chip 12-1 is formed to have the uniformand thin thickness of the whole chip portion. The second-stage andthird-stage semiconductor chips 12-2, 12-3 are formed to be thicker thanthe first-stage semiconductor chip 12-1 and have overhung portions 17-2,17-3 on two sides which face ball bonding portions of the lower-stagechips on the backsides. The overhung portions 17-2, 17-3 form spaces toaccommodate the ball bonding portions between the chips and the mainsurfaces of the semiconductor chips arranged under them. The overhungportions 17-2, 17-3 are respectively covered with insulating layers18-2, 18-3 to prevent short circuits and leaks between the bonding wires16-1, 16-2 and the backsides of the upper-stage chips 12-2, 12-3.

FIG. 2 schematically shows the cross section of the second-stagesemiconductor chip 12-2 (or the third-stage semiconductor chip 12-3) ofthe stack MCP shown in FIG. 1. FIG. 3 is an enlarged cross sectionalview showing a portion near the ball bonding portions of the first-stageand second-stage semiconductor chips of the stack MCP shown in FIG. 1.

As shown in FIG. 2, semiconductor elements 19-2 are formed on the mainsurface of the semiconductor chip 12-2 and bonding pads 15-2A, 15-2B forwire bonding are arranged along the two opposite sides of the chip 12-2.Further, overhung portions 17-2A, 17-2B are formed on the opposite twosides corresponding to the bonding pads 15-2A, 15-2B on the backside ofthe semiconductor chip 12-2. The overhung portions 17-2A, 17-2B are soformed that each thickness thereof will be gradually increased in adirection from the outer peripheral portion toward the inner portion.More specifically, the overhung portion 17-2B (17-2A) is formed to havea curved surface having a start point SP in a position at a distance Δd(=0.05 mm) from the center of the bonding pad 15-2B (15-2A), becomegradually thinner toward the outer periphery and have an end point EPwhich reaches the side wall of the chip 12-2. In this example, thecurved surface of each of the overhung portions 17-2A, 17-2B has theradius of curvature of 0.05 mm to 2.5 mm. The degree of roughness of thecurved surface of each of the overhung portions 17-2A, 17-2B ispreferably set to #2000 or less in order to prevent concentration of thestress caused by application of pressure at the ball bonding time andthe concentration of the stress can be effectively suppressed if thesurface is mirror-finished.

As shown in FIG. 3, a space to accommodate a ball bonding portion isformed between the chip 12-2 and the main surface of the lower-stagechip 12-1 by the presence of the overhung portion 17-2B (17-2A). It isnecessary to set the thickness (edge thickness) Δb of the side wall ofthe chip 12-2 to approximately 10 to 50 μm and set the height of theoverhung portion of the chip 12-2 to approximately 70 μm in the case ofa normal wire bonder although they are different depending on pressureapplied at the time of ball bonding to the bonding pad 15-2B (15-2A).Further, it is preferable that the distance Δa from the outer peripheryof the chip (end point EP) to the start point SP do not exceed 5 mm andit is preferable to set the distance in a range of 200 μm to 1.3 mm.

Next, the manufacturing method of the stack MCP shown in FIG. 1 isexplained in detail with reference to FIGS. 4A, 4B to FIGS. 11A, 11B.FIGS. 4A to 11A are perspective views and FIGS. 4B to 11B are crosssectional views of FIGS. 4A to 11A.

First, semiconductor elements are formed and bonding pads electricallyconnected to the semiconductor elements are formed on the main surfaceof the semiconductor wafer by a known manufacturing process.

Then, as shown in FIGS. 4A, 4B, first grooves 22-1, 22-2, 22-3, . . .are formed along dicing lines or chip dividing lines in the main surfaceof the semiconductor wafer 20 by use of a diamond blade 21 or the like(half-cut dicing).

Next, as shown in FIGS. 5A, 5B, a BSG tape (surface protection tape) 23is affixed to the main surface of the semiconductor wafer 20 and secondgrooves 25-1, 25-2, . . . used to form the overhung portions are formedalong the dicing lines or chip dividing lines in the backside of thesemiconductor wafer 20 by use of a diamond blade 24. The second grooves25-1, 25-2, . . . are formed in positions corresponding to the twoopposite sides of each semiconductor chip 12 as shown in FIGS. 12A, 12Bor formed in positions corresponding to the four opposite sides of eachsemiconductor chip 12 as shown in FIGS. 33A, 33B. In the firstembodiment, a case wherein they are formed on the four sides is shown asan example. The second grooves 25-1, 25-2, . . . are formed to haveopening portions which are wider than regions between bonding pads ofthe adjacent semiconductor chips in portions on the backsidecorresponding to the bonding pads between the adjacent semiconductorchips and formed to depths to reach at least the first grooves 22-1,22-2, 22-3, . . . .

At the time of formation of the second grooves 25-1, 25-2, . . . , forexample, as shown in FIG. 13, a blade having a tip portion whose crosssection is a curved surface is used. As shown in FIG. 14, if the tipportion is formed in a semi-circular form with the radius R (R=ZZ/2), anoverhung portion with the width ZZ and the curvature of the radius R canbe formed. Further, as shown in FIG. 15, if the cross section of the tipportion is part of a circle, an overhung portion with the curved surfacecan be formed in the same manner.

Next, as shown in FIGS. 6A, 6B, the backside of the semiconductor wafer20 is ground and the wafer is finished to desired thickness by use of agrinding stone 26 or the like. Thus, the semiconductor wafer 20 isdiscretely divided to form semiconductor chips 12, 12, . . . .

As shown in FIG. 16, insulating layers 18 are formed on the surfaces ofthe overhung portions thus formed. As the insulating layer 18, forexample, a silicon oxide film or organic material such as polyimide canbe used. Further, as shown in FIG. 17, if insulating layers 18 areformed not only on the surfaces of the overhung portions but also on theside walls of the groove 22-1 (side walls of the chip 12), a shortcircuit or leak due to contact with a bonding wire can be effectivelyprevented.

After this, as shown in FIGS. 7A, 7B, the discretely dividedsemiconductor chips 12, 12, . . . are placed on a stage 31 and a DAF (ora bonding agent) 27 and dicing tape 28 are affixed to the backside byuse of a roller 29 and thus the wafer is mounted on a wafer ring 30. Inthis case, the DAF 27 and dicing tape 28 are affixed in an integralform, but there occurs no problem even if discretely divided DAFs anddicing tapes are affixed.

Then, as shown in FIGS. 8A, 8B, the surface protection tape 23 isseparated.

Next, as shown in FIGS. 9A, 9B, a diamond blade 32 with the widthsmaller than gaps between the discretely divided semiconductor chips 12,12, . . . is used to perform a dicing process again to cut apart the DAF27. At this time, when a polyimide-series organic material is used toform the DAF 27, polyimide is scattered and attached to the inner wallsof the second grooves 25-1, 25-2, . . . at the dicing time. Thus, theoverhung portion of the backside of the chip and the bonding wire of thelower-stage chip can be effectively prevented from being short-circuitedor causing a leak when the chips are stacked.

After this, as shown in FIGS. 10A, 10B, the chips (good chips) areseparated from the dicing tape 28 and picked up for each chip. In thepickup step, the backside of the dicing tape 28 is pushed up for eachchip 12 by use of pickup needles 33 and the needles penetrate throughthe dicing tape 28 so as to be brought into direct contact with thebackside of the chip 12 and are further pushed upwardly to separate thechip 12 together with the DAF 27 from the dicing tape 28. At this time,as shown in FIG. 18, the pickup needles 33 are brought into contact withthe thick portion of the chip 12 and pushed upward to separate the chipfrom the dicing tape 28. The DAF 27 is adhered to the backside of thethus separated chip 12 and the chip is fed in this state while the chipsurface is attracted by a tool called a collet 34.

Next, the chips 12 thus fed by the collet 34 are stacked and mounted onthe circuit board 11 having the external connection electrodes 14-1,14-2, . . . and stacked in a multi-layered form by electricallyconnecting bonding pads formed on the main surface of each semiconductorchip to printed wirings formed on the chip mounting surface of thecircuit board 11 by wire bonding each time the semiconductor chip ismounted.

In FIGS. 11A, 11B, a case wherein the first-stage chip 12-1 has uniformand small thickness is taken as an example and a state in which it issubjected to wire bonding is shown. The semiconductor chip 12-2 formedin the step described above is stacked and mounted on the chip 12-1 withthe DAF 27 disposed therebetween and then a wire bonding process isperformed to electrically connect the bonding pads of the chip 12-2 toprinted wirings formed on the chip mounting surface of the circuit board11. When the chip 12-2 is stacked and mounted on the chip 12-1, theoverhung portions are arranged in correspondence to the ball bondingportions of the semiconductor chip 12-1 arranged in the lower stage.Thus, spaces to accommodate the ball bonding portions are formed betweenthe chip 12-2 and the main surface of the chip 12-1 arranged in thelower stage. When the chip 12-2 is stacked, portions of the DAF 27 lyingunder the spaces are bent upwardly and placed between the bonding wiresnear the ball bonding portions of the chip 12-1 and the overhungportions to fix the bonding wires. In addition, occurrence of a shortcircuit or leak between the bonding wire and the overhung portion of thechip 12-2 is suppressed.

At the time of wire bonding of the chip 12-2, as shown in FIGS. 19A,19B, 19C, after the bonding pad 15-2 of the chip 12-2 is subjected toball bonding by use of a capillary 35, the capillary 35 is moved on thecircuit board 11 to wedge-bond the printed wiring while the bonding wireis extended. At the ball bonding time, pressure is applied to thebonding pad 15-2, but the pressure is dispersed to the overhung portion17-2 to reduce the bending amount of the chip 12-2.

FIG. 20 shows the simulation result of the bending of the chip at theball bonding time. In the simulation, the bending amount when a stepportion is formed in a vertical direction with respect to the overhungportion (solid line L1), the bending amount when the overhung shape isformed with the radius of curvature 85 μm (solid line L2) and thebending amount when the overhung shape is formed with the radius ofcurvature 2000 μm (solid line L3) in a case where the chip thickness isset to 30 μm, 50 μm, 70 μm are shown. As is clearly seen from FIG. 20,the bending amount of the chip can be significantly reduced by selectingthe shape of the overhung portion.

After this, the process of stacking a plurality of semiconductor chipsand the wire bonding process are repeatedly performed according to thepackage structure.

Then, the stacked semiconductor chips, bonding wires and the chipmounting surface of the circuit board 11 are covered with a resin moldor the like to form a package 10.

With the above structure, the semiconductor chips with the same size orwith different sizes in which the upper-stage chip is larger than thelower-stage chip can be stacked without using spacers and DAFs betweenthe semiconductor chips. Further, since the bonding wire of thesemiconductor chip arranged in the lower stage can be prevented frombeing brought into contact with the backside of the upper-stage chip byuse of the insulating layer formed to cover the overhung portion, thethickness of the package can be reduced. In this case, the centralportion of the semiconductor chip is substantially made thicker byapproximately the thickness of a spacer, but the thickness can bereduced since the DAF (10 μm thickness) is made unnecessary. Therefore,when the number of chips to be stacked becomes larger, the effectattained by reducing the thickness becomes significant and the number ofstacked stages of the chips can be increased if the thickness of thepackage is kept unchanged.

Further, with the above manufacturing method, since the semiconductorwafer is diced in the thick state and divided by grinding and etching,occurrence of chippings on the backside of the chip can be suppressed.

Since the central portion of the semiconductor chip is thick and theperipheral portion thereof is thin, the warp can be made small incomparison with a case wherein the whole portion is made thin and itbecomes easy to deal with the semiconductor chip. Thus, occurrence of arecognition error at the time of position detection performed by usingan optical system such as a TV camera when the chip is mounted can bereduced.

Occurrence of chip cracks can be reduced by applying pressure to thethick portion of the chip by use of pickup needles when eachsemiconductor chip is picked up from the dicing tape after thesemiconductor wafer is discretely divided. Further, the deflection(bending) of the semiconductor chip is reduced when it is attracted bythe collet and occurrence of voids in the adhering and pressure-bondingprocess for die bonding can be suppressed.

Since the semiconductor chips to be stacked in the second and succeedingstages can be suppressed from being bent by applying pressure at theball bonding time, the bonding characteristic can be improved andoccurrence of chip cracks can be suppressed. According to the simulationof the inventor of this application and others, it is confirmed that theelement bending can be improved by 4% to 55% in comparison with theconventional case.

When the semiconductor chips with the same size or with different sizesin which the upper-stage chip is larger than the lower-stage chip arestacked, it is not necessary to dispose spacers and DAFs between thechips. Therefore, the material costs of the spacers and DAFs can beomitted, the costs for the processing and bonding steps are madeunnecessary, and a lowering in the cost and enhancement of theproductivity can be attained. In addition, even if the semiconductorchip is made thin, a short circuit and leak between the bonding wire andthe backside of the semiconductor chip arranged in the upper stage canbe prevented by use of the insulating layer.

It is possible to use a low-cost bonding agent in a paste state orliquid state instead of the DAF because the bonding agent will not creepup to the main surface of the chip due to the fact that the bonding areabetween the semiconductor chips is made small, the chip itself can bemade thick and the overhung portion exists in the chip peripheralportion.

This invention is not limited to the first embodiment described aboveand can be variously modified and embodied. Next, various modificationsare explained.

[Modifications 1, 2 of the Overhung Shape of the Semiconductor Chip inthe First Embodiment and the Forming Method Thereof]

FIGS. 21A, 21B and FIGS. 22A, 22B show other examples of the overhungshape of the semiconductor chip 12. In the semiconductor chip 12 shownin FIGS. 21A, 21B, regions ranging from the start points SP to portionsbelow the bonding pads 15A, 15B are curved surfaces and regions rangingfrom the portions below the bonding pads 15A, 15B to the chip endportions (end portions EP) are planes. The radius of curvature of theabove curved surface is 0.01 mm to 2.5 mm and the distance Δe of theplane is 80 μm. That is, the semiconductor chip 12 has the overhungportions 17A, 17B which are each formed of a combination of the curvedsurface and one plane.

In the semiconductor chip 12 shown in FIGS. 22A, 22B, regions extendingfrom the start points SP are vertical planes, regions ranging from theintermediate portions of the vertical planes to portions below thebonding pads 15A, 15B are curved surfaces and regions ranging from theportions below the bonding pads 15A, 15B to the chip end portions (endportions EP) are planes. The radius of curvature of the above curvedsurface is 0.01 mm to 2.5 mm and the distance Δe of each of the verticalplane and horizontal plane is 80 μm. That is, the semiconductor chip 12has the overhung portions 17A, 17B which are each formed of acombination of the curved surface and two planes.

FIG. 23 shows a cross sectional shape of the blade 24 used to form theoverhung portions 17A, 17B shown in FIGS. 21A, 21B and FIGS. 22A, 22B.As shown in FIG. 23, each of the front end corner portions has theradius of curvature R. If the grooves 25 are formed by use of theportion with the radius of curvature R of the blade 24, the overhungportions 17A, 17B as shown in FIGS. 21A, 21B can be formed. Further, ifthe grooves 25 are formed by use of a portion which is deeper than theportion with the radius of curvature R of the blade 24, the overhungportions 17A, 17B as shown in FIGS. 22A, 22B can be formed.

As shown in FIG. 24, the overhung portions 17A, 17B with the same shapecan be formed by forming a plurality of grooves 25 by use of a bladehaving the front end portion whose cross section is the curved surfaceas shown in FIGS. 13 and 14 while shifting the blade position asindicated by an arrow.

FIGS. 25 and 26 are photomicrographs of the semiconductor chip 12 havingthe overhung portions 17A, 17B formed by forming a plurality of grooves25 while shifting the blade position as shown in FIG. 24. In FIG. 25,the thickness of the semiconductor chip is 196 μm, the distance from thestart point SP of the overhung portion to the end point EP isapproximately 570 μm and the thickness (edge thickness) Δb of the chipend portion is approximately 30 μm. In FIG. 26, the thickness of thesemiconductor chip is 196 μm, the distance from the start point SP ofthe overhung portion to the end point EP is approximately 900 μm and thethickness (edge thickness) Δb of the chip end portion is approximately50 μm.

FIGS. 27 and 28 are photomicrographs of states in which semiconductorchips having overhung portions with various sizes formed are stacked. InFIGS. 27 and 28, BBG (represented by the uppermost semiconductor chip)of the overhung portion of each semiconductor chip shows a portion inwhich ball bonding is performed. It is understood that sufficientlylarge spaces used to accommodate the ball bonding portions can be formedbetween the semiconductor chip and the main surface of the semiconductorchip arranged in the lower stage owing to the overhung portions.

The example in which the chips with the same size or including theupper-stage chip which is larger than the lower-stage chip are stackedis explained in the first embodiment. However, as shown in FIGS. 27 and28, even when the chip of the upper stage with the smaller size isstacked, the effect can be attained if chips including an upper-stagechip whose outer peripheral portion does not lie inside the bondingposition indicated by a vertical short line are stacked and connected bywire bonding.

[Modifications 3, 4 of the Overhung Shape of the Semiconductor Chip inthe First Embodiment and the Forming Method Thereof]

FIGS. 29A, 29B and FIGS. 30A, 30B show still other examples of theoverhung shape of the semiconductor chip 12. In the semiconductor chip12 shown in FIGS. 29A, 29B, regions starting from the start points SPare vertical planes with respect to the main surface of the chip,regions ranging from the vertical planes to portions below the bondingpads 15A, 15B are planes with large inclination angles and regionsranging from the portions below the bonding pads 15A, 15B to the chipend portions (end points EP) are planes. The distance Δe1 of the planeis 40 μm, the distance Δe2 of the plane is 60 μm and the distance Δe3 ofthe plane is 100 μm. The planes are set in contact with each other atangles Δf1, Δf2 lying between 90 degrees and 180 degrees. That is, theoverhung portions 17A, 17B of the semiconductor chip 12 are each formedof a combination (composite plane) of three planes whose inclinationangles are different.

In the semiconductor chip shown in FIGS. 30A, 30B, regions starting fromthe start points SP vertically extend with respect to the main surfaceof the chip and regions extending from the intermediate portions of thevertical planes and reaching the chip side walls (end points EP) areplanes with constant inclination angles. The distance Δe1 of the planeis 40 μm and the distance Δe2 of the plane is 330 μm. The planes are setin contact with each other at an angle Δf lying between 90 degrees and180 degrees. That is, the overhung portions 17A, 17B of thesemiconductor chip 12 are each formed of a combination of two planes.

Of course, the region extending from the start point SP to the chip sidewall (end point EP) may be formed of one plane which becomes thinner ina direction towards the outer periphery and having a constantinclination angle.

FIG. 31 shows a cross sectional shape of the blade 24 used to form theoverhung portions 17A, 17B shown in FIGS. 29A, 29B. As shown in FIG. 31,the corner portions of the tip have inclination angles corresponding tothe angles Δf1, Δf2. If the groove 25 is formed by use of the blade 24,the overhung portions shown in FIGS. 29A, 29B can be formed.

Further, if the inclination angle of the blade 24 is set to aninclination angle corresponding to the angle Δf as shown by brokenlines, the overhung portions 17A, 17B shown in FIGS. 30A, 30B can beformed.

As shown in FIG. 32, if a blade having plane corner portions withcertain inclination angles and a tip portion of a curved surface isused, overhung portions having curved surfaces which extend fromportions lying below the bonding pads 15A, 15B to the end points EP canbe formed.

[A Modification 1 of the Forming Position of Grooves Used to Form theOverhung Portions in the First Embodiment]

In the first embodiment described above, a case wherein the overhungportions are formed in one direction along the dicing lines or chipdividing lines (along the two opposite sides of the chip) of thesemiconductor wafer as shown in FIGS. 12A, 12B and a case wherein theoverhung portions are formed along the four sides of the chip as shownin FIGS. 33 a, 33B are explained.

The formation position of the overhung portion is not necessarilydetermined according to the arrangement of the bonding pads of the chiparranged in the lower stage. It is possible to form overhung portionsalong the two opposite sides as shown in FIGS. 12A, 12B when the bondingpads of the lower-stage chip are formed on one side of the chip.Further, it is possible to form overhung portions along all of thedicing lines or chip dividing lines (four opposite sides of the chip) ofthe semiconductor wafer as shown in FIGS. 33A, 33B when the bonding padsof the lower-stage chip are formed on one side, two sides or three sidesof each chip.

[A Modification 2 of the Forming Position of Grooves Used to Form theOverhung Portions in the First Embodiment]

The same operation and effect can be attained by forming the overhungportions by cutting away only portions corresponding to the bondingwires as shown in FIGS. 34A, 34B.

In FIGS. 34A, 34B, the cut-away portions are formed along the twoopposite sides of the chip, but it is of course possible to form thecut-away portions along one side, three sides or four sides of the chip.

[A Modification of a Method of Forming Grooves in the First Embodiment]

After the second grooves 25-1, 25-2, . . . are formed to form theoverhung portions in the step shown in FIGS. 5A, 5B and before theinsulating layers 18 are formed, portions in the second grooves 25-1,25-2, . . . are etched. For the etching process, a plasma etching or wetetching process can be applied and a CMP process can be used. Thus,processing distortion such as cutting distortion or cutting scratches bythe diamond blade 24 can be eliminated.

Next, various modifications of the stacked structure of thesemiconductor chips shown in FIG. 1 are explained with reference toFIGS. 35 to 41. The basic structures of FIGS. 35 to 41 are the same asthat of FIG. 1 and only the portions different from the structure shownin FIG. 1 are explained below.

[A Modification 1 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

FIG. 35 shows another example of the stacked structure of thesemiconductor chips in the stack MCP. In this example, the sizes offirst-stage and second-stage semiconductor chips 12-1, 12-2 are the sameand the size of a third-stage semiconductor chip 12-3 is larger thanthat of the semiconductor chip 12-1, 12-2.

[A Modification 2 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In an example shown in FIG. 36, the sizes of first-stage andsecond-stage semiconductor chips 12-1, 12-2 are the same, the size of athird-stage semiconductor chip 12-3 is smaller than that of thesemiconductor chips 12-1, 12-2, and the outer periphery thereof is setinside the wire bonding portions.

[A Modification 3 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In an example shown in FIG. 37, a first-stage semiconductor chip 12-1 ismounted on the surface of the circuit board 11 by use of a flip chip anda second-stage semiconductor chip 12-2 of the same size is mounted onthe backside of the chip 12-1 with a DAF disposed therebetween. The chip12-2 is connected to printed wirings formed on the chip mounting surfaceof the circuit board 11 via bonding wires 16-2. On the chip 12-2, athird-stage semiconductor chip 12-3 with the size larger than thefirst-stage and second-stage semiconductor chips 12-1, 12-2 is mountedwith a DAF disposed therebetween and overhung portions thereof arearranged to form spaces which accommodate ball bonding portions betweenthe overhung portions and the main surface of the chip 12-2. The chip12-3 is connected to printed wirings formed on the chip mounting surfaceof the circuit board 11 via bonding wires 16-3. On the chip 12-3, afourth-stage semiconductor chip 12-4 is mounted with a DAF disposedtherebetween. The size of the chip 12-4 is smaller than that of the chip12-3 and the outer periphery thereof is set inside the wire bondingportions.

In FIG. 37, the first-stage chip 12-1 is mounted (pressure-bonded) onthe circuit board 11 by use of a flip chip method, but the chip stackedin the upper stage can be mounted on the lower-stage chip by use of theflip chip method if the sizes thereof (the positions of the bondingpads) are the same.

[A Modification 4 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In an example shown in FIG. 38, a fifth-stage semiconductor chip 12-5 isfurther stacked on the fourth-stage semiconductor chip 12-4 shown inFIG. 37. The fifth-stage semiconductor chip 12-5 is mounted on the chip12-4 with a DAF disposed therebetween so that the overhung portionsthereof may be arranged to form spaces which accommodate ball bondingportions between the overhung portions and the main surface of the chip12-4. The chip 12-5 is connected to printed wirings formed on the chipmounting surface of the circuit board 11 via bonding wires 16-5.

[A Modification 5 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In an example shown in FIG. 39, the spaces formed between the mainsurface of the chip 12-1 and the overhung portions of the chip 12-2 arefilled with insulating members 37-1 formed of polyimide-series orepoxy-series resin in the stack MCP shown in FIG. 1. Further, the spacesformed between the main surface of the chip 12-2 and the overhungportions of the chip 12-3 are filled with insulating members 37-2 formedof polyimide-series or epoxy-series resin.

Penetration of water into the bonding portions can be more effectivelyprevented by use of the insulating members 37-1, 37-2 and thus thereliability can be enhanced. Further, since the bonding connectionmargin of the upper-stage chip can be enhanced by filling the spaceslying under the overhung portions with the insulating members 37-1, thechip can be made thin.

[A Modification 6 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In the example shown in FIG. 39, the chip 12-2 is mounted on the chip12-1 and the chip 12-3 is mounted on the chip 12-2 with the DAFsrespectively disposed therebetween. However, in an example shown in FIG.40, the chip 12-2 is affixed and mounted on the chip 12-1 by use ofinsulating members 37-1 filled into spaces between the main surface ofthe chip 12-1 and the overhung portions of the chip 12-2 and the chip12-3 is affixed and mounted on the chip 12-2 by use of insulatingmembers 37-2 filled into spaces between the main surface of the chip12-2 and the overhung portions of the chip 12-3.

Thus, the chips can adhered to each other by use of the insulatingmembers 37-1, 37-2 filled into the spaces instead of the DAFs.

[A Modification 7 of the Stacked Structure of the Semiconductor Chips inthe First Embodiment]

In an example shown in FIG. 41, the spaces formed between the mainsurface of the chip 12-2 and the overhung portions of the chip 12-3 arefilled with insulating members 37 formed of polyimide-series orepoxy-series resin in the stack MCP shown in FIG. 37.

Penetration of water into the bonding portions can be more effectivelyprevented by the presence of the insulating members 37 and thus thereliability can be enhanced.

Further, like the case of the stacked structure shown in FIGS. 35, 36and 38, it is possible to fill the spaces between the main surface ofthe lower-stage chip and the overhung portions of the upper-stage chipwith the insulating members formed of polyimide-series or epoxy-seriesresin.

In this case, as shown in FIG. 40, insulating members can be used forbonding between the chips instead of the DAFs.

Next, various modifications of the manufacturing process are explained.

[A Modification 1 of the Manufacturing Process in the First Embodiment]

FIGS. 42A, 42B to FIGS. 50A, 50B are shown to explain anothermanufacturing process (modification 1) of the stack MCP, FIGS. 42A to50A are perspective views and FIGS. 42B to 50B are cross sectional viewsof FIGS. 42A to 50A.

The manufacturing process in the modification 1 is different from theprocess shown in FIGS. 4A, 4B to FIGS. 11A, 11B in that the backside ofa semiconductor wafer is ground in the backside grinding step shown inFIGS. 44A, 44B and then the ground surface is mirror-finished byperforming the plasma etching, wet etching, dry polishing, gas etching,CMP, buffing process or the like. In FIGS. 45A, 45B, a mirror-finishingstep by use of a polishing device 38 is shown.

Since other basic manufacturing steps are the same as those shown inFIGS. 4A, 4B to FIGS. 11A, 11B, the same portions are denoted by thesame reference symbols and the detail explanation thereof is omitted.

According to the above manufacturing method, occurrence of cracks orbreakage at the pickup time can be suppressed by making flat thebackside of the chip. Further, concentration of stress caused bypressure applied at the ball bonding time can be prevented by makingflat the inner walls of the grooves 25-1, 25-2, . . . .

[A Modification 2 of the Manufacturing Process in the First Embodiment]

FIGS. 51A, 51B to FIGS. 58A, 58B are shown to explain anothermanufacturing process (modification 2) of the stack MCP, FIGS. 51A to58A are perspective views and FIGS. 51B to 58B are cross sectional viewsof FIGS. 51A to 58A.

The manufacturing process in the modification 2 is different from theprocess shown in FIGS. 4A, 4B to FIGS. 11A, 11B in that the forming stepof the second grooves 25-1, 25-2, . . . is performed after the backsidegrinding process of the semiconductor wafer.

Since other basic manufacturing steps are the same as those shown inFIGS. 4A, 4B to FIGS. 11A, 11B, the same portions are denoted by thesame reference symbols and the detail explanation thereof is omitted.

With the above manufacturing method, the operation and effect which arebasically the same as those of the method shown in FIGS. 4A, 4B to FIGS.11A, 11B can be attained.

[A Modification 3 of the Manufacturing Process in the First Embodiment]

FIGS. 59A, 59B to FIGS. 67A, 67B are shown to explain anothermanufacturing process (modification 3) of the stack MCP, FIGS. 59A to67A are perspective views and FIGS. 59B to 67B are cross sectional viewsof FIGS. 59A to 67A.

The manufacturing process in the modification 3 is a combination of themodifications 1 and 2 and performs a second groove forming step afterthe backside grinding step of the semiconductor wafer and then performsa mirror-finishing process by performing the plasma etching, wetetching, dry polishing, gas etching, CMP, buffing process or the like.FIGS. 62A, 62B representatively show the polishing process.

Since other basic manufacturing steps are the same as those of themodifications 1 and 2, the same portions are denoted by the samereference symbols and the detail explanation thereof is omitted.

With the above manufacturing method, the operation and effect which arebasically the same as those of the method shown in FIGS. 4A, 4B to FIGS.11A, 11B and the modifications 1 and 2 can be attained.

[A Modification 4 of the Manufacturing Process in the First Embodiment]

FIGS. 68A, 68B to FIGS. 76A, 76B are shown to explain anothermanufacturing process (modification 4) of the stack MCP, FIGS. 68A to76A are perspective views and FIGS. 68B to 76B are cross sectional viewsof FIGS. 68A to 76A.

In the first embodiment and the modifications 1 to 3, the DAF 27 anddicing tape 28 are simultaneously affixed to the semiconductor wafer.However, in the manufacturing process of the modification 4, the DAF 27and dicing tape 28 are affixed to the semiconductor wafer in differentsteps.

That is, first, semiconductor elements are formed on the main surface ofthe semiconductor wafer and then bonding pads electrically connected tothe semiconductor elements are formed by a known manufacturing process.

Next, as shown in FIGS. 68A, 68B, first grooves 22-1, 22-2, 22-3, . . .are formed along dicing lines or chip dividing lines in the main surfaceof the semiconductor wafer 20 by use of a diamond blade 21 or the like(half-cut dicing).

Next, as shown in FIGS. 69A, 69B, a BSG tape (surface protection tape)23 is affixed to the main surface of the semiconductor wafer 20 and thebackside portion of the semiconductor wafer is ground by use of agrinding stone 26 or the like so as to set the semiconductor wafer todesired thickness. As a result, the semiconductor wafer 20 is discretelydivided to form semiconductor chips 12, 12, . . . .

Next, as shown in FIGS. 70A, 70B, the ground surface is mirror-finishedby performing the plasma etching, wet etching, dry polishing, gasetching, CMP, buffing process or the like. In FIGS. 70A, 70B, thepolishing process is shown as a representative.

After this, the wafer 20 is placed on a stage 31 and a DAF (or a bondingagent) 27 is affixed to the mirror-finished backside by use of a roller29 or the like.

Next, the DAF 27 is cut apart along the dicing lines or chip dividinglines on the backside of the semiconductor wafer 20 by use of a blade 24to form second grooves 25-1, 25-2, . . . used to form overhung portionsalong the two or four opposite sides of the chips (in this example, acase wherein the second grooves are formed along the four sides).

On the surfaces of the overhung portions thus formed, insulating layers18 are formed as shown in FIG. 16. As the insulating layer 18, forexample, a silicon oxide film or an organic material such as polyimidecan be used. Further, by forming the insulating layers 18 not only onthe surfaces of the overhung portions but also on the side walls of thechips 12 as shown in FIG. 17, occurrence of a short circuit or leak dueto contact with the bonding wire can be effectively prevented.

After this, as shown in FIGS. 73A, 73B, the semiconductor chips 12, 12,. . . with the cut-apart DAFs 27 are placed on the stage 31, then adicing tape 28 is affixed to the DAFs 27 by use of a roller 29 and thusthe wafer is mounted on a wafer ring 30.

Then, as shown in FIGS. 74A, 74B, the surface protection tape 23 isseparated.

Next, as shown in FIGS. 75A, 75B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be brought into direct contact with the backside of the chip12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, as shown in FIG. 18, the pickup needles 33are brought into contact with the thick portions of the chip 12 andpushed upward to separate the chip from the dicing tape 28. The DAF 27is adhered to the backside of the thus separated chip 12 and the chip isfed in this state while the chip surface is attracted by a collet 34.

Next, the chips 12 thus fed by the collet 34 are stacked and mounted onthe circuit board 11 having external connection electrodes 14-1, 14-2, .. . and stacked in a multi-layered form by electrically connectingsemiconductor elements formed on the main surface of each semiconductorchip with printed wirings of the circuit board 11 by wire bonding eachtime the semiconductor chip is mounted.

In FIGS. 76A, 76B, a case wherein the first-stage chip 12-1 has uniformand small thickness is taken as an example and a wire bonded state isshown. The semiconductor chip 12-2 formed in the step described above isstacked and mounted on the chip 12-1 with the DAF 27 disposedtherebetween and then a wire bonding process is performed toelectrically connect the bonding pads of the chip 12-2 to printedwirings formed on the surface of the circuit board 11. When the chip12-2 is stacked and mounted on the chip 12-1, the overhung portions arearranged in positions corresponding to the ball bonding portions of thesemiconductor chip arranged in the lower stage. Thus, spaces toaccommodate the ball bonding portions are formed between the chip 12-2and the main surface of the chip 12-1 arranged in the lower stage.

After this, the process of stacking a plurality of semiconductor chipsand the wire bonding process are repeatedly performed according to thepackage structure.

Then, the stacked semiconductor chips and wire bonding portions arecovered with sealing resin (mold resin) (or molded).

[A Modification 5 of the Manufacturing Process in the First Embodiment]

FIGS. 77A, 77B to FIGS. 85A, 85B are shown to explain still anothermanufacturing process (modification 5) of the above stack MCP, FIGS. 77Ato 85A are perspective views and FIGS. 77B to 85B are cross sectionalviews of FIGS. 77A to 85A.

As shown in FIGS. 78A, 78B, the manufacturing process of themodification 5 is to form the ground surface of the semiconductor waferto depth so as not to reach the first grooves 22-1, 22-2, 22-3, . . .when the backside of the semiconductor wafer is ground. Therefore, thewafer 20 is not discretely divided in the backside grinding step and isdiscretely divided when second grooves 25-1, 25-2, . . . are formedalong the dicing lines or chip dividing lines in a step shown in FIGS.81A, 81B.

In this modification, since it is necessary to form the second grooves25-1, 25-2, . . . along all of the dicing lines or chip dividing lineswhen the first grooves 22-1, 22-2, 22-3, . . . are formed with the samedepth, overhung portions are formed along the four sides of the chips.

Of course, if portions of two opposite sides of the chip in whichoverhung portions are to be formed are made shallow and portions of theother two sides are made deep at the time of formation of the firstgrooves 22-1, 22-2, 22-3, . . . and the backside is ground to reach thedeep grooves formed along the other two sides at the backside grindingtime, the semiconductor wafer can be discretely divided into individualchips at the time of formation of the second grooves 25-1, 25-2, . . . .

The other basic manufacturing steps are the same as those of themodification 4 and, therefore, the same portions are denoted by the samereference symbols and the detail explanation thereof is omitted.

With the above manufacturing method, the same operation and effect asthose of the modification 4 can be basically attained.

[A Modification 6 of the Manufacturing Process in the First Embodiment]

FIGS. 86A, 86B to FIGS. 92A, 92B illustrate another manufacturingprocess (modification 6) of the stack MCP, FIGS. 86A to 92A areperspective views and 86B to 92B are cross sectional views of FIGS. 86Ato 92A.

The manufacturing process of the modification 6 is different from thoseof the above first embodiment and the modifications 1 to 5 in that firstgrooves 22-1, 22-2, 22-3, . . . which discretely divide the wafer areformed after second grooves 25-1, 25-2, . . . to form overhung portionsare formed.

That is, first, semiconductor elements are formed on the main surface ofthe semiconductor wafer and then bonding pads electrically connected tothe semiconductor elements are formed by a known manufacturing process.

Next, as shown in FIGS. 86A, 86B, the backside portion of thesemiconductor wafer 20 is ground by use of a grinding stone 26 or thelike to desired thickness.

Then, as shown in FIGS. 87A, 87B, a BSG tape (surface protection tape)23 is affixed to the main surface of the semiconductor wafer 20 and theground surface is mirror-finished by performing the plasma etching, wetetching, dry polishing, gas etching, CMP, buffing process or the like.In FIGS. 87A, 87B, the polishing process is shown as a representative.

After this, as shown in FIGS. 88A, 88B, second grooves 25-1, 25-2, . . .are formed along the dicing lines or chip dividing lines in the backsideof the semiconductor wafer 20 by use of a blade 24.

Insulating layers 18 are formed on the internal surfaces of the secondgrooves 25-1, 25-2, . . . thus formed as shown in FIG. 16. As theinsulating layer 18, for example, a silicon oxide film or organicmaterial such as polyimide can be used. Further, as shown in FIG. 17, ifinsulating layers 18 are formed not only on the surface of the overhungportion but also on the side wall of the chip, a short circuit or leakdue to contact with a bonding wire can be effectively prevented.

Next, as shown in FIGS. 89A, 89B, the wafer 20 is placed on a stage 31,a DAF (or a bonding agent) 27 and dicing tape 28 are affixed to themirror-finished backside by use of a roller 29 and then the wafer ismounted on a wafer ring 30.

After this, as shown in FIGS. 90A, 90B, the semiconductor wafer 20 isdiced (full-cut dicing) along the dicing lines or chip dividing lines ofthe wafer on the main surface of the wafer by use of a diamond blade 32or the like. Thus, the semiconductor wafer 20 is discretely divided toform semiconductor chips 12, 12, . . . .

Next, as shown in FIGS. 91A, 91B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be directly brought into contact with the backside of thechip 12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, as shown in FIG. 18, the pickup needles 33are brought into contact with the thick portions of the chip 12 andpushed upward to separate the chip from the dicing tape 28. The DAF 27is adhered to the backside of the thus separated chip 12 and the chip isfed in this state while the chip surface is attracted by a collet 34.

After this, as shown in FIGS. 92A, 92B, the chips 12 thus fed by thecollet 34 are stacked and mounted on the circuit board 11 having theexternal connection electrodes 14-1, 14-2, . . . and stacked in amulti-layered form by electrically connecting semiconductor elementsformed on the main surface of each semiconductor chip to printed wiringsof the circuit board by wire bonding each time the semiconductor chip ismounted.

In FIGS. 92A, 92B, a case wherein the first-stage chip 12-1 has uniformand small thickness is taken as an example and a state in which it issubjected to wire bonding is shown. The semiconductor chip 12-2 formedin the step described above is stacked and mounted on the chip 12-1 withthe DAF 27 disposed therebetween and then a wire bonding process isperformed to electrically connect the bonding pads of the chip 12-2 toprinted wirings formed on the surface of the circuit board 11. When thechip 12-2 is stacked and mounted on the chip 12-1, the overhung portionsare arranged to correspond in position to the ball bonding portions ofthe semiconductor chip arranged in the lower stage. Thus, spaces whichaccommodate the ball bonding portions are formed between the overhungportions and the main surface of the chip 12-1 arranged in the lowerstage.

After this, the process of stacking a plurality of semiconductor chipsand the wire bonding process are repeatedly performed according to thepackage structure.

Then, the stacked semiconductor chips and wire bonding portions arecovered with sealing resin (mold resin) (or molded).

[A Modification 7 of the Manufacturing Process in the First Embodiment]

FIGS. 93A, 93B to FIGS. 100A, 100B illustrate another manufacturingprocess (modification 7) of the stack MCP, FIGS. 93A to 100A areperspective views and 93B to 100B are cross sectional views of FIGS. 93Ato 100A.

The manufacturing process of the modification 7 is different from themodification 6 in that a DAF is affixed to the backside of thesemiconductor wafer after the backside thereof is mirror-finished.

That is, the backside of the wafer is mirror-finished as shown in FIGS.94A, 94B and then a DAF 27 is affixed to the backside of the wafer 20 asshown in FIGS. 95A, 95B to form second grooves 25-1, 25-2, . . . asshown in FIGS. 96A, 96B. After this, a dicing tape 28 is affixed to theDAF 27 by use of a roller 29 or the like as shown in FIGS. 97A, 97B andthus the wafer is mounted on a wafer ring 30. Then, as shown in FIGS.98A, 98B, the wafer 20 is discretely divided to form semiconductor chips12 by use of a diamond blade 32 or the like.

The other manufacturing steps are the same as those of the modification6, and therefore, the detail explanation thereof is omitted.

[A Modification 8 of the Manufacturing Process in the First Embodiment]

FIGS. 101A, 101B to FIGS. 107A, 107B illustrate another manufacturingprocess (modification 8) of the stack MCP, FIGS. 101A to 107A areperspective views and 101B to 107B are cross sectional views of FIGS.101A to 107A.

In the manufacturing process of the modification 8, the chips are bondedtogether without using a DAF to form the structure as shown in FIG. 40.

That is, first, semiconductor elements are formed on the main surface ofthe semiconductor wafer and then bonding pads electrically connected tothe semiconductor elements are formed by a known manufacturing process.

Then, as shown in FIGS. 101A, 101B, first grooves 22-1, 22-2, 22-3, . .. are formed along dicing lines or chip dividing lines in the mainsurface of the semiconductor wafer 20 by use of a diamond blade 21 orthe like (half-cut dicing).

Next, as shown in FIGS. 102A, 102B, a BSG tape (surface protection tape)23 is affixed to the main surface of the semiconductor wafer 20 andsecond grooves 25-1, 25-2, . . . used to form the overhung portions areformed along the dicing lines or chip dividing lines in the backside ofthe semiconductor wafer 20 by use of a diamond blade 24. The secondgrooves 25-1, 25-2, . . . are formed in positions corresponding to thetwo or four opposite sides of each semiconductor chip 12 as shown inFIGS. 12A, 12B. The second grooves 25-1, 25-2, . . . are formed to haveopening portions which are formed wider than regions between bondingpads of the adjacent semiconductor chips in portions of the backsidecorresponding to the bonding pads between the adjacent semiconductorchips and formed to depths to reach at least the first grooves 22-1,22-2, 22-3, . . . .

As shown in FIG. 16, insulating layers 18 are formed on the surfaces ofthe overhung portions thus formed. As the insulating layer 18, forexample, a silicon oxide film or organic material such as polyimide canbe used. Further, as shown in FIG. 17, if insulating layers 18 areformed not only on the surface of the overhung portion but also on theside wall of the chip 12, a short circuit or leak due to contact with abonding wire can be effectively prevented.

After this, as shown in FIGS. 103A, 103B, the backside portion of thesemiconductor wafer 20 is ground and finished to desired thickness byuse of a grinding stone 26 or the like. As a result, the semiconductorwafer 20 is discretely divided to form semiconductor chips 12, 12, . . ..

Next, as shown in FIGS. 104A, 104B, the discretely divided semiconductorchips 12, 12, . . . are placed on a stage 31 and a dicing tape 28 isaffixed to the backside by use of a roller 29 and the wafer is mountedon a wafer ring 30.

Then, as shown in FIGS. 105A, 105B, the surface protection tape 23 isseparated.

Next, as shown in FIGS. 106A, 106B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be brought into direct contact with the backside of the chip12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, as shown in FIG. 18, the pickup needles 33are brought into contact with the thick portions of the chip 12 andpushed upward to separate the chip from the dicing tape 28. The thusseparated chip is fed while the chip surface is attracted by a collet34.

Next, the chips 12 thus fed by the collet 34 are stacked and mounted onthe circuit board 11 having external connection electrodes 14-1, 14-2, .. . and stacked in a multi-layered form by electrically connectingsemiconductor elements formed on the main surface of each semiconductorchip to printed wirings of the circuit board 11 by wire bonding eachtime the semiconductor chip is mounted.

In FIGS. 107A, 107B, a case wherein the first-stage chip 12-1 hasuniform and small thickness is taken as an example and a wire bondedstate is shown. Next, a bonding agent (insulating member) 37 formed ofresin or the like is coated on the chip 12-1, the semiconductor chip12-2 formed in the step described above is stacked and mounted on thechip 12-1 with the bonding agent 37 disposed therebetween and then awire bonding process is performed to electrically connect the bondingpads of the chip 12-2 to printed wirings formed on the surface of thecircuit board 11. When the chip 12-2 is stacked and mounted on the chip12-1, the overhung portions are arranged to correspond in position tothe ball bonding portions of the semiconductor chip arranged in thelower stage. At this time, spaces which accommodate the ball bondingportions are formed between the overhung portions and the main surfaceof the chip 12-1, the bonding agent 37 flows into each space and thewire bonding portions of the chip 12-1 and bonding wires are embedded inthe bonding agent 37.

After this, the process of stacking a plurality of semiconductor chipsand the wire bonding process are repeatedly performed according to thepackage structure.

Then, the stacked semiconductor chips and wire bonding portions arecovered with sealing resin (mold resin) (or molded).

[A Modification 9 of the Manufacturing Process in the First Embodiment]

FIGS. 108A, 108B to FIGS. 116A, 116B are shown to explain anothermanufacturing process (modification 9) of the above stack MCP, FIGS.108A to 116A are perspective views and FIGS. 108B to 116B are crosssectional views of FIGS. 108A to 116A.

The manufacturing process of the modification 9 is basically the same asthat of the modification 4 shown in FIGS. 68A, 68B to FIGS. 76A, 76B,but is different in that the wire bonding portions and bonding wires aredirectly sealed by use of an insulating member such as a bonding agent.The manufacturing method is adequate to form the structure shown in FIG.39.

In FIGS. 108A, 108B to FIGS. 116A, 116B, the same structures and thesame steps as those in FIGS. 68A, 68B to FIGS. 76A, 76B are denoted bythe same reference symbols and the detail explanation thereof isomitted.

That is, as shown in FIGS. 116A, 116B, a bonding agent (insulatingmember 37) formed of resin or the like is coated on the wire bondingportions of the chip 12-1 and the chip 12-2 is stacked and mounted onthe chip 12-2 with the DAF 27 disposed therebetween so that the overhungportions will correspond in position to the ball bonding portions of thesemiconductor chip 12-1 arranged in the lower stage. At this time,spaces which accommodate the ball bonding portions are formed betweenthe overhung portions and the main surface of the chip 12-1 arranged inthe lower stage. The bonding agents 37 flow into the spaces so that thebonding wires and the wire bonding portions of the chip 12-1 may beembedded in the bonding agents. After this, the wire bonding process isperformed to electrically connect the bonding pads of the chip 12-2 tothe printed wirings formed on the surface of the circuit board 11.

[A Modification 10 of the Manufacturing Process in the First Embodiment]

In the manufacturing process of the modification 8, the voids can beprevented from being formed between the chips in the die bonding stepshown in FIGS. 107A, 107B by forming air vent grooves in the backside ofthe chip after the backside grinding step of FIGS. 103A, 103B. Thus, ashort circuit and leak between the chips can be prevented.

Further, since the adhesive area between the chip and the dicing tape 27is made smaller and the adhesive strength becomes weaker if the air ventgrooves are formed in the backside of the chip, occurrence of cracks ofthe chip in the pickup step shown in FIGS. 106A, 106B can be reduced.

[A Modification 11 of the Manufacturing Process in the First Embodiment]

In the manufacturing process in the first embodiment and themodifications 1 to 10, the blade system is used when the first andsecond grooves are formed, but a laser system (grooves and improvementof the interior quality), a cutter, etching (such as RIE) process orwire scribing process can be used and a combination of a plurality ofmethods can be used.

[A Modification 12 of the Manufacturing Process in the First Embodiment]

As the DAF in the manufacturing process of the first embodiment and themodifications 1 to 7, 9 and 10, polyimide-series or epoxy-series resincan be used. Further, a material of a component which is not etched canbe used.

[A Modification 13 of the Manufacturing Process in the First Embodiment]

An example in which the DAF is cut apart by use of the blade system isshown, but the DAF can be cut apart by use of a laser system (groovesand improvement of the interior quality), a cutter, etching process orwire scribing process, for example.

[A Modification 14 of the Manufacturing Process in the First Embodiment]

An example in which the pin system is performed in the pickup step isexplained, but various methods such as a painless system, ultrasonicsystem and tapeless system can be applied.

[A Modification 15 of the Manufacturing Process in the First Embodiment]

The wire bonding system can be applied to either the positive bonding(including the reverse bonding like positive bonding) or the reversebonding.

[A Modification 16 of the Manufacturing Process in the First Embodiment]

The sealing step into the package 10 is not limited to the mold (resinsealing) system, but can be applied to a film sealing system or apotting system of sealing by dropping liquid resin.

Next, various manufacturing methods of fixing and sealing the bondingportions and bonding wires with the insulating members 37 are explainedwith reference to FIGS. 117A, 117B to FIGS. 121A, 121B.

A Step Example 1 of Fixing and Sealing Ball Bonding Portions by Use ofan Insulating Member

FIGS. 117A, 117B show a step example of fixing and sealing the bondingportions shown in FIGS. 107A, 107B and FIGS. 116A, 116B by use of theinsulating member 37. The step shown in FIGS. 117A, 117B shows a stateobtained after the first-stage chip 12-1 is placed on the circuit board11, wire-bonded and mounted thereon. The insulating member 37 such as ainsulating bonding agent or sealing agent is supplied from a dispensernozzle 36 onto the ball bonding portions of the chip 12-1. The bondingpads of the chip 12-2 are electrically connected to printed wiringsformed on the surface of the circuit board 11 by wire bonding after thesemiconductor chip 12-2 formed in the step as described above wasstacked and mounted on the chip 12-1. When the chip 12-2 is stacked andmounted on the chip 12-1, the overhung portions are arranged tocorrespond in position to the ball bonding portions of the chip 12-1arranged in the lower stage. A space formed between the main surface ofthe chip 12-1 arranged in the lower stage and the overhung portion ofthe chip 12-2 mounted thereon is filled with the insulating member 37.

A Step Example 2 of Fixing and Sealing Ball Bonding Portions by Use ofan Insulating Member

In the step example 1, the insulating member is formed in a region inwhich the bonding wires and the bonding portions formed on the twoopposite sides of the chip 12-1 are formed, but as shown in FIGS. 118A,118B, an insulating member 37 can be coated on a region along the foursides of the chip 12-1.

A Step Example 3 of Fixing and Sealing Ball Bonding Portions by Use ofInsulating Members

As shown in FIGS. 119A, 119B, insulating members 37 such as resin can bedropped from a dispenser nozzle 36 onto the chip 12-1. In this case, theball bonding portions and bonding wires are embedded in the resin pushedout from under the chip 12-2 into the peripheral portion when the chip12-2 is mounted on the chip 12-1.

A Step Example 4 of Fixing and Sealing Ball Bonding Portions by Use ofan Insulating Member

As shown in FIGS. 120A, 120B, an insulating member 37 such as resin canbe emitted from a dispenser nozzle 36 onto the chip 12-1 and is coatedto cover the surface thereof. Also, in this case, the ball bondingportions and bonding wires are embedded in the resin pushed out fromunder the chip 12-2 into the peripheral portion when the chip 12-2 ismounted on the chip 12-1.

A Step Example 5 of Fixing and Sealing Ball Bonding Portions by Use ofan Insulating Member

An insulating member 37 such as resin can be coated on the overhungportions of the chip 12-2 as shown in FIG. 121A and the ball bondingportions and bonding wires can be embedded in the insulating member whenthe chip 12-2 is mounted on the chip 12-1.

FIGS. 122 and 123 are photomicrographs obtained when semiconductor chipshaving overhung portions formed therein are stacked and spaces arefilled with insulating members. FIG. 122 shows a case wherein resin isused as the insulating member and FIG. 123 shows a case whereininsulating paste is used as the insulating member.

A Step Example 6 of Fixing and Sealing Ball Bonding Portions by Use ofInsulating Members

In the step examples 1 to 5, the one-point nozzle system is explained,but a multi-point nozzle system or a system of scanning by use of aone-point nozzle system (a single stroke of the nozzle) can be used.Further, the chip can be dipped into a tray in which resin is containedand the resin can be adhered to the backside of the chip. In addition, atransfer system can be used and various combinations of the transfersystems of transfer to the central portion of the main surface of thelower-stage chip, transfer onto the ball bonding portions and transferto the chip central portion and onto the ball bonding portions can beused.

A Step Example 7 of Fixing and Sealing Ball Bonding Portions by Use ofInsulating Members

As the insulating member, various insulating type members such as a DAFmaterial (die attach film), insulating paste, under-fill material,liquid resin, potting resin and B-stage resin (epoxy resin) can be used.

Therefore, according to the first embodiment and the modificationsthereof, a semiconductor device can be provided in which the package canbe made thin without causing defective portions due to cracks in thesemiconductor chip and occurrence of leak or contact between the bondingwires of the semiconductor chip and the backside of the upper-stagechip.

Further, since the spacer and the DAF used to adhere the spacer to thechip become unnecessary, a manufacturing method of the semiconductordevice in which the manufacturing cost is lowered and the productivityis enhanced can be attained.

Second Embodiment

FIG. 124 is a cross sectional view of a semiconductor device accordingto a second embodiment of this invention. In this case, a COC packagetype semiconductor device having three semiconductor chips with the samesize stacked is taken as an example. Three semiconductor chips 12-1,12-2, 12-3 with the same size are stacked and mounted on a circuit board11 with DAFs (die attach films) 13-1, 13-2, 13-3 disposed therebetween,respectively. For example, the circuit board 11 has a multi-layeredwiring structure. Electrode pads on which stud bumps 56-1 are formed areprovided on the chip mounting surface of the circuit board 11 andexternal connection electrodes 14-1, 14-2, 14-3, . . . such as solderballs and pins are arranged in an array form on the backside of the chipto form a so-called ball grid array or pin grid array.

Through electrodes 55-1, 55-2, 55-3 formed of copper (Cu), gold (Au),tungsten (W) or polysilicon are provided along the two (or four)opposite sides of the respective semiconductor chips 12-1, 12-2, 12-3.The through electrodes 55-1, 55-2, 55-3 and the electrode pads formed onthe chip mounting surface of the circuit board 11 are respectivelyconnected together via Au stud bumps 56-1, 56-2, 56-3.

The through electrodes 55-1, 55-2, 55-3 are formed in through holeswhich are respectively formed to penetrate through the semiconductorchips 12-1, 12-2, 12-3 while insulating films each formed of a siliconoxide film or organic material of polyimide, for example, are disposedtherebetween. The through electrodes are electrically connected tosemiconductor elements formed on the main surface of the respectivesemiconductor chips 12-1, 12-2, 12-3.

The electrode pads formed on the chip mounting surface of the circuitboard 11 are connected to the external connection electrodes 14-1, 14-2,14-3, . . . via the multi-layered wiring structure formed in the circuitboard 11. Thus, the semiconductor chips 12-1, 12-2, 12-3 areelectrically connected to the external connection electrodes 14-1, 14-2,14-3, . . . .

The semiconductor chip 12-1 is formed to have overhung portions 17-1 ontwo (or four) opposite sides corresponding in position to the electrodepads formed on the chip mounting surface of the circuit board 11. Thesemiconductor chips 12-2, 12-3 are formed to have overhung portions17-2, 17-3 on two (or four) opposite sides corresponding in position tothe through electrodes of the lower-stage chips 12-1, 12-2 of thebacksides thereof, respectively. The overhung portions 17-1, 17-2, 17-3form spaces (accommodating portions) to accommodate the stud bumps 56-1to 56-3 between the respective overhung portions and the chip mountingsurface of the circuit board 11 and the main surfaces of thesemiconductor chips 12-1, 12-2 arranged in the lower stages,respectively.

The semiconductor chips 12-1, 12-2, 12-3, stud bumps 56-1, 56-2, 56-3and the chip mounting surface of the circuit board 11 are sealed into apackage 10 formed of resin or the like.

FIG. 125 schematically shows a cross section of the semiconductor chip12 (12-1 to 12-3). FIG. 126 is an enlarged cross sectional view showinga portion near the stud bumps and through electrodes of the first-stageand second-stage semiconductor chips 12-1, 12-2 (or the second-stage andthird-stage semiconductor chips 12-2, 12-3) shown in FIG. 124.

As shown in FIG. 125, a semiconductor element 19 is formed on the mainsurface of the semiconductor chip 12 and through electrodes 55A, 55B arearranged along the two (or four) opposite sides of the chip 12. Thethrough electrodes 55A, 55B are respectively formed in the through holesformed through the semiconductor chip 12 with insulating layers 58A, 58Bdisposed therebetween and electrically connected to the semiconductorelement 19 formed on the main surface of the semiconductor chip 12.

Overhung portions 17A, 17B are formed on the two (or four) oppositesides of the backside of the semiconductor chip 12 corresponding inposition to the through electrodes 55A, 55B. The overhung portions 17A,17B are so formed that the chip thicknesses thereof are graduallyincreased in a direction from the outer peripheral portion toward theinner portion. More specifically, the overhung portion has a curvedsurface portion which has a start point SP in a position at a distanceΔd (=0.05 mm to 1.3 mm) from the center of the through electrode 55B,becomes thinner toward the outer periphery and has an end point EPreaching the side wall of the chip 12. In this example, the curvedsurfaces of the overhung portions 17A, 17B each have the radius ofcurvature of 0.05 mm to 2.5 mm. The degree of roughness of the curvedsurface of the overhung portions 17A, 17B is preferably set to #2000 orless in order to prevent concentration of the stress caused when studbumps 56-1, 56-2, 56-3 are formed and the concentration of the stresscan be effectively suppressed if the surface is mirror-finished.

As shown in FIG. 126, an accommodating portion to accommodate the studbump 56-2 is formed between the overhung portion 17B and the mainsurface of the lower-stage chip 12-1. It is necessary to set thethickness Δb of the side wall of the chip 12-2 to approximately 10 to 50μm and set the thickness of the overhung portion of the chip 12-2 toapproximately 70 μm in the case of normal stud bumps or ball bumpsalthough they are different depending on the shape and size of theconnection electrodes. Further, it is preferable that the distance Δafrom the outer periphery of the chip (end point EP) to the start pointSP do not exceed 5 mm and it is preferable to set the distance in arange of 200 μm to 1.3 mm.

Next, the manufacturing method of the COC package type semiconductordevice shown in FIG. 124 is explained in detail with reference to FIGS.127A, 127B to FIGS. 134A, 134B. FIGS. 127A to 134A are perspective viewsand FIGS. 127B to 134B are cross sectional views of FIGS. 127A to 134A.

First, semiconductor elements are formed on the main surface of thesemiconductor wafer and through electrodes electrically connected to thesemiconductor elements are formed by a known manufacturing process. Thethrough electrodes may be formed through the semiconductor wafer, but ifthey are formed to shallow depth so as to be exposed in the laterbackside grinding step, the formation step thereof can be made easy andthe manufacturing cost can be lowered.

Then, as shown in FIGS. 127A, 127B, first grooves 22-1, 22-2, 22-3, . .. are formed along dicing lines or chip dividing lines in the mainsurface of the semiconductor wafer 20 by use of a diamond blade 21 orthe like (half-cut dicing).

Next, as shown in FIGS. 128A, 128B, a BSG tape (surface protection tape)23 is affixed to the main surface (the element formation surface) of thesemiconductor wafer 20 and the backside portion thereof is ground andfinished to desired thickness by a grinding stone 26 or the like. As aresult, the semiconductor wafer 20 is discretely divided so as to formsemiconductor chips 12, 12, . . . . The ground surface is etched asrequired after the backside grinding step.

Next, as shown in FIGS. 129A, 129B, second grooves 25-1, 25-2, . . .used to form the overhung portions are formed along the dicing lines orchip dividing lines on the backside of the semiconductor wafer 20 by useof a diamond blade 24. The second grooves 25-1, 25-2, . . . are formedin positions corresponding to the two opposite sides of thesemiconductor chip 12 as shown in FIGS. 135A, 135B or formed inpositions corresponding to the four opposite sides of the semiconductorchip 12 as shown in FIGS. 144A, 144B. In FIGS. 129A, 129B, a casewherein they are formed on the four sides is shown as an example. Thesecond grooves 25-1, 25-2, . . . are formed to have opening portionswhich are wider than regions between the through electrodes 55 ofadjacent semiconductor chips 12 on the backside thereof corresponding inposition to the through electrodes between the adjacent semiconductorchips 12.

At the time of formation of the second grooves 25-1, 25-2, . . . , forexample, as shown in FIG. 136, a blade having a tip portion whose crosssection is a curved surface is used. As shown in FIG. 14, if the tipportion is formed in a semi-circular form with the radius R (R=ZZ/2), anoverhung portion with the width ZZ and the curvature of the radius R canbe formed.

Next, as shown in FIGS. 130A, 130B, the backside of the semiconductorwafer 20 (discretely divided semiconductor chips 12, 12, . . . ) issubjected to the plasma etching, wet etching or CMP process so as toprotrude the through electrodes 55 from the backside. In FIGS. 130A,130B, the working process by a CMP polishing device 38 is shown as arepresentative.

After this, as shown in FIGS. 131A, 131B, the semiconductor wafer 20 isplaced on a stage 31, a DAF (or a bonding agent) 27 and dicing tape 28are affixed to the backside by use of a roller 29 and thus the wafer ismounted on a wafer ring 30. In this case, the DAF 27 and dicing tape 28are affixed in an integral form, but there occurs no problem even ifdiscretely divided DAFs and dicing tapes are affixed.

Then, as shown in FIGS. 132A, 132B, the surface protection tape 23 isseparated.

Next, as shown in FIGS. 133A, 133B, a diamond blade 32 with the widthsmaller than a gap between the discretely divided semiconductor chips 12is used to perform a dicing process again to cut apart the DAF 27.

After this, as shown in FIGS. 134A, 134B, the chips (good chips) areseparated from the dicing tape 28 and picked up for each chip. In thepickup step, the backside of the dicing tape 28 is pushed up for eachchip 12 by use of pickup needles 33 and the needles penetrate throughthe dicing tape 28 so as to be brought into direct contact with thebackside of the chip 12 and are further pushed upwardly to separate thechip 12 from the dicing tape 28. At this time, the pickup needles 33 arebrought into contact with the thick portions of the chip 12 and pushedupward to separate the chip from the dicing tape 28. The DAF 27 isadhered to the backside of the thus separated chip and the chip is fedwhile the chip surface is attracted by a tool called a collet 34.

Next, the chips 12 thus fed by the collet 34 are pressed against(thermocompression bonded by heating as required) and mounted on thecircuit board 11 having external connection electrodes 14-1, 14-2, . . .by die bonding with stud bumps disposed therebetween. When the chip ismounted, the chip is stacked while the overhung portions thereof are setto correspond in position to the stud bumps formed on the circuit board11 or the stud bumps formed on the through electrodes of thesemiconductor chip arranged in the lower stage. Thus, accommodatingportions which accommodate the through electrodes are formed between theoverhung portions and the chip mounting surface of the circuit board 11or the main surface of the chip arranged in the lower stage. When thechip is die-bonded, the connection between the stud bump and the throughelectrode can be made more effective and stronger by application ofultrasonic waves.

Then, the stacked semiconductor chips, stud bumps and the chip mountingsurface of the circuit board 11 are covered with resin mold or the liketo form a package 10.

With the above structure, the chips can be stacked with the stud bumps56-1, 56-2, 56-3 accommodated in the overhung portions 17-1, 17-2, 17-3,and therefore, the thickness of the structure can be reduced by thethickness of the connection electrodes and the package can be made thin.

Further, with the above manufacturing method, since the semiconductorwafer is subjected to the half-cut dicing process while thesemiconductor wafer is thick and then it is divided by grinding andetching, occurrence of chippings on the backside of the chip can besuppressed.

Since the central portion of the semiconductor chip is thick and theperipheral portion thereof is thin, the warp can be made small incomparison with a case wherein the whole portion is made thin and itbecomes easy to deal with the semiconductor chip. Thus, occurrence of arecognition error at the time of position detection performed by usingan optical system such as a TV camera when the chip is mounted can bereduced.

Occurrence of chip cracks can be reduced by applying pressure to thethick portion of the chip by use of pickup needles when eachsemiconductor chip is picked up from the dicing tape after thesemiconductor wafer is discretely divided. Further, the deflection(bending) of the semiconductor chip when it is attracted by the colletis reduced and occurrence of voids in the adhering and pressure-bondingprocess for die bonding can be suppressed.

Since the chip can be suppressed from being bent at the die-bondingtime, the bonding characteristic can be enhanced and occurrence of chipcracks can be suppressed. According to the simulation by the inventor ofthis application, it is confirmed that the degree of element bending canbe improved by approximately 4% to 55% in comparison with theconventional case in the above condition.

Thus, since faults due to occurrence of chippings and cracks of thesemiconductor wafer and due to occurrence of the warp and bending of thesemiconductor chip can be reduced, the manufacturing cost can be loweredand the productivity can be enhanced.

This invention is not limited to the second embodiment and can bevariously modified. Next, various modifications are explained.

[Modifications 1, 2 of the Overhung Shape of the Semiconductor Chip inthe Second Embodiment and the Manufacturing Method Thereof]

FIGS. 137A, 137B and FIGS. 38A, 138B show other examples of the overhungshape of the semiconductor chip 12. The semiconductor chip 12 shown inFIGS. 137A, 137B has a curved surface in a region extending from a startpoint SP to a portion under the through electrode 55A, 55B and a planein a region extending from the portion under the through electrode 55A,55B to the chip end portion (terminal end EP). The radius of curvatureof the above curved surface is 0.01 mm to 2.5 mm and the distance Δe ofthe plane is 80 μm. That is, the semiconductor chip 12 has the overhungportions 17A, 17B which are each formed of a combination of the curvedsurface and one plane.

In the semiconductor chip 12 shown in FIGS. 138A, 138B, regionsextending from the start points SP are vertical planes with respect tothe main surface of the chip 12, regions ranging from the intermediateportions of the vertical planes to portions under the connectionelectrodes 55A, 55B are curved surfaces and regions ranging from theportions under the connection electrodes 55A, 55B to the chip endportions (terminal ends EP) are planes. The radius of curvature of theabove curved surface is 0.01 mm to 2.5 mm and the distance Δe of thevertical plane and horizontal plane is 80 μm. That is, the semiconductorchip 12 has the overhung portions 17A, 17B which are each formed of acombination of the curved surface and two planes.

A blade 24 having a cross sectional shape as shown in FIG. 23 is used inorder to form the overhung portions 17A, 17B shown in FIGS. 137A, 137Band FIGS. 138A, 138B. That is, if a portion with the radius R ofcurvature of the blade 24 having the front end corner portions with theradius of curvature R is used to form the grooves 25, the overhungportions 17A, 17B as shown in FIGS. 17A, 17B can be formed. If thegrooves 25 are formed by use of a portion deeper than the portion withthe radius R of curvature of the blade 24, the overhung portions 17A,17B as shown in FIGS. 138A, 138B can be formed.

As shown in FIG. 139, the overhung portions 17A, 17B with the same shapecan be formed by forming a plurality of grooves 25 by use of the blade24 in which the cross section of the front end portion is the curvedsurface as shown in FIG. 136 while shifting the position of the blade asindicated by an arrow.

[A Modification 3 of the Overhung Shape of the Semiconductor Chip in theSecond Embodiment and the Manufacturing Method Thereof]

In the second embodiment and the modifications 1, 2, a case wherein thecurved surface which forms the overhung shape of the semiconductor chipor a portion thereof is a convex surface having the constant radius ofcurvature is explained, but the radius of curvature is not necessarilyset constant.

For example, the cross section of the overhung shape may be a convexsurface of a shape corresponding to a parabola.

[Modifications 4, 5 of the Overhung Shape of the Semiconductor Chip inthe Second Embodiment and the Manufacturing Method Thereof]

FIGS. 140A, 140B and FIGS. 141A, 141B show still other examples of thestructure of the overhung shape of the semiconductor chip 12. In thesemiconductor chip 12 shown in FIGS. 140A, 140B, regions extending fromthe start points SP are vertical planes with respect to the main surfaceof the chip 12, regions extending from the intermediate portions of thevertical planes to portions under the connection electrodes 55A, 55B areplanes having large inclination angles and regions extending from theportions under the connection electrodes 55A, 55B to the chip endportions (terminal ends EP) are planes parallel to the main surface ofthe circuit board. The distance Δe1 of the plane is 40 μm, the distanceΔe2 of the plane is 60 μm and the distance Δe3 of the plane is 100 μm.The planes contact with one another with angles Δf1, Δf2 between 90degrees and 180 degrees. That is, the overhung portions 17A, 17B of thesemiconductor chip 12 are each formed of a combination of three planeshaving different inclination angles (combined planes).

In the semiconductor chip 12 shown in FIGS. 141A, 141B, regionsextending from the start points SP are vertical planes with respect tothe main surface of the chip 12 and regions extending from theintermediate portions of the vertical planes to the chip side walls(terminal ends EP) are planes having constant inclination angles. Thedistance Δe1 of the plane is 40 μm and the distance Δe2 of the plane is330 μm. The planes are set in contact with each other with an angle Δfbetween 90 degrees and 180 degrees. That is, the overhung portions 17A,17B of the semiconductor chip 12 are each formed of a combination of twoplanes.

Of course, the region extending from the start point SP to the chip sidewall (end point EP) may be formed of one plane which makes the thicknessof the overhung portion smaller in a direction towards the outerperiphery and has a constant inclination angle.

In order to form the overhung portions 17A, 17B shown in FIGS. 140A,140B, the blade 24 of the cross section as shown in FIG. 31 can be used.As shown in the drawing, the front end corner portions have inclinationangles corresponding to the angles Δf1, Δf2. If the grooves 25 areformed by use of the blade 24, the overhung portions 17A, 17B shown inFIGS. 140A, 140B can be formed.

Further, if the inclination angle of the blade 24 is set to aninclination angle corresponding to the angle Δf as shown by brokenlines, the overhung portions 17A, 17B as shown in FIGS. 141A, 141B canbe formed.

As shown in FIG. 32, if a blade having corner portions of planes withinclination angles and a tip portion of a curved surface is used,overhung portions having curved surfaces which extend from portionslying under the connection electrodes 55A, 55B to the end points EP canbe formed.

[A Modification 1 of the Forming Position of Grooves Used to Form theOverhung Portions in the Second Embodiment]

As shown in FIGS. 135A, 135B, in the second embodiment, a case whereinthe overhung portions are formed in one direction along the dicing linesor chip dividing lines of the semiconductor wafer (along the twoopposite sides of the chip) and a case wherein the overhung portions areformed along the four sides of the chip as shown in FIGS. 144A, 144B areexplained.

The forming positions of the overhung portions are not necessarilydetermined according to the arrangement of the through electrodes of thechip arranged in the lower stage. When the through electrodes of thechip arranged in the lower stage are formed on one side of the chip, theoverhung portions can be formed along the two opposite sides as shown inFIGS. 135A, 135B. Further, when they are formed on one side, two sidesor three sides of the chip, the overhung portions can be formed alongall of the dicing lines, or chip dividing lines of the semiconductorwafer (along the four opposite sides of the chip) as shown in FIGS.144A, 144B.

[A Modification 2 of the Forming Position of Grooves Used to Form theOverhung Portions in the Second Embodiment]

The forming positions of the overhung portions are not necessarilylimited to the two or four sides (of course, one side or three sides canbe used) of the semiconductor chip. However, when the through electrodes55 are linearly arranged in the central portion of the chip 12, theoverhung portions can be linearly arranged along the two opposite sidesand a central portion in parallel to the two sides (in this example,they are referred to as grooves 43-1, 43-2, . . . ) as shown in FIGS.142A, 142B. Further, the grooves 43-1, 43-2, . . . can be linearlyarranged along the four sides and central portion of the chip as shownin FIGS. 145A, 145B. In addition, the overhung portions can be arrangedalong the four sides of the chip and grooves 43-1, 43-2, . . . and 44-1,44-2, . . . can be arranged in a cross-shaped form in the centralportion as shown in FIGS. 146A, 146B or grooves 45 can be arranged in anarray form in the four sides and central portion of the chip as shown inFIGS. 147A, 147B.

[A Modification 3 of the Formation Position of the Grooves Used to Formthe Overhung Portions in the Second Embodiment]

The overhung portions can be formed by cutting away only portionscorresponding to the stud bumps to form grooves 46 as shown in FIGS.143A, 143B, and in this case, the same operation and effect as describedabove can be attained.

In FIGS. 143A, 143B, the grooves 46 are formed along the two oppositesides of the chip, but it is of course possible to form the groovesalong the four sides of the chip.

Next, various modifications of the stacked structure of thesemiconductor chip shown in FIG. 124 are explained with reference toFIGS. 148 to 172.

[A Modification of the Overhung Portions in the Second Embodiment]

Like the case of the first embodiment, the insulating layer 18 can beformed on the surface of each overhung portion. As the insulating layer18, a silicon oxide film or an organic material such as polyimide can beused, for example. Further, the insulating layers can be formed not onlyon the surface of the overhung portion but also on the side walls of thegroove 22 (the side walls of the chip 12).

[A Modification 1 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

FIG. 148 shows another example of the stacked structure of thesemiconductor chips in the COC package type semiconductor device. Inthis example, spaces (accommodating portions) formed between the chipmounting surface of the circuit board 11 and the overhung portions ofthe first-stage semiconductor chip 12-1 shown in FIG. 124, spaces(accommodating portions) formed between the main surface of thefirst-stage semiconductor chip 12-1 and the overhung portions of thesecond-stage semiconductor chip 12-2 and spaces (accommodating portions)formed between the main surface of the second-stage semiconductor chip12-2 and the overhung portions of the third-stage semiconductor chip12-3 are respectively filled with insulating members 37-1, 37-2 and37-3. As the insulating members 37-1, 37-2, 37-3, polyimide-series orepoxy-series resin is used, for example.

Since the other basic structure is the same as that of FIG. 124, thesame portions are denoted by the same reference symbols and theexplanation thereof is omitted.

With the above structure, entrance of water into the connectionelectrodes can be effectively prevented by use of the insulating members37-1, 37-2, 37-3 and the reliability can be enhanced. Further, since thebonding margin can be increased by embedding the overhung portions withthe insulating members 37-1, 37-2, 37-3, the chip can be made thin.

[A Modification 2 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In an example shown in FIG. 149, spacers 39-1, 39-2 are respectivelydisposed between the main surface of the first-stage semiconductor chip12-1 and the backside of the second-stage semiconductor chip 12-2 andbetween the main surface of the second-stage semiconductor chip 12-2 andthe backside of the third-stage semiconductor chip 12-3. Wirings aremade on the front and backsides of the spacers 39-1, 39-2 toelectrically connect the lower-stage semiconductor chip with theupper-stage semiconductor chip.

A semiconductor chip having the front and backsides on which re-wiringsare made by use of a circuit board or re-wiring process can be usedinstead of the spacers 39-1, 39-2 on which wirings are made.

The semiconductor chip on which the re-wirings are made is asemiconductor chip in which an insulating film is formed in portionsother than the electrodes of the front and backsides, wiring layers areformed on the insulating film, then an insulating film is formed andelectrodes are formed in positions corresponding to the upper-stagechip.

[A Modification 3 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In an example shown in FIG. 150, insulating members 37-1, 37-2, 37-3 arerespectively disposed between the circuit board 11 and the backside ofthe first-stage semiconductor chip 12-1, between the spacer 39-1 and thebackside of the second-stage semiconductor chip 12-2 and between thespacer 39-2 and the backside of the third-stage semiconductor chip 12-3without using DAFs in the structure shown in FIG. 149. Then, spacesformed between the chip mounting surface of the circuit board 11 and theoverhung portions of the first-stage semiconductor chip 12-1, betweenthe spacer 39-1 and the overhung portions of the second-stagesemiconductor chip 12-2 and between the spacer 39-2 and the overhungportions of the third-stage semiconductor chip 12-3 are respectivelyfilled with the insulating members 37-1, 37-2 and 37-3.

Of course, like the structure shown in FIG. 149, a semiconductor chiphaving the front and backsides on which re-wirings are made by use of acircuit board or re-wiring process can be used instead of the spacers39-1, 39-2 on which wirings are made.

[A Modification 4 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In the second embodiment and the modifications thereof, the chips of thesame chip size are stacked, but in an example shown in FIG. 151, chipsof different sizes are stacked. That is, circuit boards 40-1, 40-2 arerespectively disposed between the main surface of the first-stagesemiconductor chip 12-1 and the backside of the second-stagesemiconductor chip 12-2 and between the main surface of the second-stagesemiconductor chip 12-2 and the backside of the third-stagesemiconductor chip 12-3. Further, stud bumps 56-2, 56-3 are formed onelectrode pads formed on the circuit boards 40-1, 40-2. Connection ofthe through electrode 55-1 of the chip 12-1 with the stud bump 56-2 ismade by use of a printed wiring formed on the circuit board 40-1,connection of the through electrode 55-2 of the chip 12-2 with the studbump 56-3 is made by use of a printed wiring formed on the circuit board40-2 and thus wirings are made by use of a re-wiring process.

With the above structure, not only the chips of the same size or thesame products but also the chips of different sizes (the positions ofthe through electrodes are different) of different products can bestacked and mounted by disposing the circuit boards 40-1, 40-2 betweenthe chips.

The same operation and effect can be attained by using a semiconductorchip having the front and backsides on which re-wirings are made by useof a re-wiring process or wired spacers instead of the circuit boards40-1, 40-2.

[A Modification 5 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In the second embodiment and the modifications thereof, the throughelectrodes of the lower-stage chips and the through electrodes of theupper-stage chips are sequentially connected, but in an example shown inFIG. 152, the through electrodes 55-1 of the first-stage semiconductorchip 12-1 are connected to the through electrodes 55-3 of thethird-stage semiconductor chip 12-3 via the stud bumps 56-2. Further,the through electrodes 55-2 of the second-stage semiconductor chip 12-2are connected to the through electrodes 55-1 of the first-stagesemiconductor chip 12-1 and the through electrodes 55-3 of thethird-stage semiconductor chip 12-3 via printed wirings formed on thecircuit board 40.

It is possible to use a semiconductor chip having the front andbacksides on which re-wirings are made by use of a re-wiring process orwired spacers instead of the circuit boards 40.

[A Modification 6 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In an example shown in FIG. 153, the second-stage semiconductor chip12-2 of FIG. 152 is mounted on the circuit board 40 by use of flip chipconnection. The third-stage semiconductor chip 12-3 is mounted on thebackside of the second-stage semiconductor chip 12-2.

In the modification 6, it is possible to use a semiconductor chip havingthe front and backsides on which re-wirings are made by use of are-wiring process or wired spacers instead of the circuit board 40.

[A Modification 7 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In an example shown in FIG. 154, the first-stage semiconductor chip 12-1and the second-stage semiconductor chip 12-2 of larger size than thechip 12-1 are mounted on the circuit board 11 by use of stud bumps 56-1,56-2 and electrode pads of the third-stage semiconductor chip 12-3 aremounted in positions corresponding to the through electrodes 55-2 of thesecond-stage semiconductor chip 12-2 by use of a flip chip or the like.

[A Modification 8 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In the second embodiment and the modifications thereof, a case whereinthe stud bumps are used is explained as an example, but in an exampleshown in FIG. 155, through electrodes 55-1, 55-2, 55-3 are formed toprotrude from the chips 12-1, 12-2, 12-4 to large extents and portionsbetween the through electrodes 55-1, 55-2 and 55-3 are connectedtogether via plated bumps 41-1, 41-2, 41-3.

The other basic structures are the same as those shown in FIG. 124, andtherefore, the same portions are denoted by the same reference symbolsand the detail explanation thereof is omitted.

[A Modification 9 of the Stacked Structure of the Semiconductor Chips inthe Second Embodiment]

In an example shown in FIG. 156, insulating members 37-1, 37-2, 37-3 arerespectively disposed between the chip mounting surface of the circuitboard 11 and the backside of the first-stage semiconductor chip 12-1,between the main surface of the chip 12-1 and the backside of thesecond-stage semiconductor chip 12-2 and between the main surface of thechip 12-2 and the backside of the third-stage semiconductor chip 12-3without using DAFs in the structure shown in FIG. 155. Further, spacesformed between the chip mounting surface of the circuit board 11 and theoverhung portions of the first-stage semiconductor chip 12-1, betweenthe main surface of the first-stage semiconductor chip 12-1 and theoverhung portions of the second-stage semiconductor chip 12-2 andbetween the main surface of the second-stage semiconductor chip 12-2 andthe overhung portions of the third-stage semiconductor chip 12-3 arerespectively filled with the insulating members 37-1, 37-2, 37-3.

[A Modification 10 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 157, chips with different sizes are stackedand circuit boards 40-1, 40-2 are respectively disposed between the mainsurface of the first-stage semiconductor chip 12-1 and the backside ofthe second-stage semiconductor chip 12-2 and between the main surface ofthe second-stage semiconductor chip 12-2 and the backside of thethird-stage semiconductor chip 12-3. The through electrodes 55-1 of thechip 12-1 are connected to the through electrodes 55-2 of the chip 12-2via printed wirings formed on the circuit board 40-1 and the throughelectrodes 55-2 of the chip 12-2 are connected to the through electrodes55-3 of the chip 12-3 via printed wirings formed on the circuit board40-2.

The same operation and effect can be attained by using a semiconductorchip having the front and backsides on which wirings are made by use ofa re-wiring process or wired spacers instead of the circuit boards 40-1,40-2.

[A Modification 11 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 158, insulating members 37-1, 37-2, 37-3 arerespectively disposed between the chip mounting surface of the circuitboard 11 and the backside of the first-stage semiconductor chip 12-1,between the circuit board 40-1 and the backside of the second-stagesemiconductor chip 12-2 and between the circuit board 40-2 and thebackside of the third-stage semiconductor chip 12-3 without using DAFsin the structure shown in FIG. 157. Further, spaces formed between thechip mounting surface of the circuit board 11 and the overhung portionsof the first-stage semiconductor chip 12-1, between the circuit board40-1 and the overhung portions of the second-stage semiconductor chip12-2 and between the circuit board 40-2 and the overhung portions of thethird-stage semiconductor chip 12-3 are respectively filled with theinsulating members 37-1, 37-2, 37-3.

[A Modification 11 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

The overhung portions of FIG. 155 can be made smaller in an exampleshown in FIG. 159 and the overhung portions of FIG. 155 can be madelarger in an example shown in FIG. 160. The size of the overhung portioncan be freely set according to the size and height of the connectionelectrode and the projection amount of the through electrode.

[A Modification 12 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 161, connections between the throughelectrodes 55-1, 55-2, 55-3 are made by use of ball bumps (solder balls)42-1, 42-2, 42-3.

The other basic structures are the same as those shown in FIG. 124, andtherefore, the same portions are denoted by the same reference symbolsand the detail explanation thereof is omitted.

[A Modification 13 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 162, insulating members 37-1, 37-2, 37-3 arerespectively disposed between the chip mounting surface of the circuitboard 11 and the backside of the first-stage semiconductor chip 12-1,between the main surface of the chip 12-1 and the backside of thesecond-stage semiconductor chip 12-2 and between the main surface of thechip 12-2 and the backside of the third-stage semiconductor chip 12-3without using DAFs in the structure shown in FIG. 161. Further, spacesformed between the chip mounting surface of the circuit board 11 and theoverhung portions of the first-stage semiconductor chip 12-1, betweenthe main surface of the first-stage semiconductor chip 12-1 and theoverhung portions of the second-stage semiconductor chip 12-2 andbetween the main surface of the second-stage semiconductor chip 12-2 andthe overhung portions of the third-stage semiconductor chip 12-3 arerespectively filled with the insulating members 37-1, 37-2, 37-3.

[A Modification 14 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 163, chips with different sizes are stackedand circuit boards 40-1, 40-2 are respectively disposed between the mainsurface of the first-stage semiconductor chip 12-1 and the backside ofthe second-stage semiconductor chip 12-2 and between the main surface ofthe second-stage semiconductor chip 12-2 and the backside of thethird-stage semiconductor chip 12-3. The through electrodes 55-1 of thechip 12-1 are connected to ball bumps 42-2 via printed wirings formed onthe circuit board 40-1 and the through electrodes 55-2 of the chip 12-2are connected to ball bumps 42-3 via printed wirings formed on thecircuit board 40-2.

The same operation and effect can be attained by using a semiconductorchip having the front and backsides on which wirings are made by use ofa re-wiring process or wired spacers instead of the circuit boards 40-1,40-2.

[A Modification 15 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 164, insulating members 37-1, 37-2, 37-3 arerespectively disposed between the chip mounting surface of the circuitboard 11 and the backside of the first-stage semiconductor chip 12-1,between the circuit board 40-1 and the backside of the second-stagesemiconductor chip 12-2 and between the circuit board 40-2 and thebackside of the third-stage semiconductor chip 12-3 without using DAFsin the structure shown in FIG. 163. Further, spaces formed between thechip mounting surface of the circuit board 11 and the overhung portionsof the first-stage semiconductor chip 12-1, between the circuit board40-1 and the overhung portions of the second-stage semiconductor chip12-2 and between the circuit board 40-2 and the overhung portions of thethird-stage semiconductor chip 12-3 are respectively filled with theinsulating members 37-1, 37-2, 37-3.

Like the modification 14, in the modification 15, a semiconductor chiphaving the front and backsides on which wirings are made by use of are-wiring process or wired spacers can be used instead of the circuitboards 40-1, 40-2.

[A Modification 16 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

The overhung portions of FIG. 161 are made smaller in an example shownin FIG. 165 and the overhung portions of FIG. 161 are made larger in anexample shown in FIG. 166. The size of the overhung portion can befreely set according to the size of the ball bumps and the projectionamount of the through electrode.

Further, if the end portions of the chips 12-1, 12-2, 12-3 are madesufficiently thin as shown in FIG. 166, connection directly from thebackside of the chip to the semiconductor elements can be made.

[A Modification 17 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In the second embodiment and the modifications thereof, a case whereinconnection electrodes such as the stud bumps, through electrodes andball bumps are formed and mounted on the two or four opposite sides ofthe chip is explained as an example. However, in an example shown inFIG. 167, grooves 47-1, 47-2, 47-3 and through electrodes 55-1, 55-2,55-3 are formed in the central portions of the chips 12-1, 12-2, 12-3and the chips are mounted on the circuit board 11 with the connectionelectrodes (in this example, the stud bumps 56-1, 56-2, 56-3 are shownas an example) disposed therebetween.

The other basic structures are the same as those shown in FIG. 124, andtherefore, the same portions are denoted by the same reference symbolsand the detail explanation thereof is omitted.

[A Modification 18 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 168, spaces formed between the chip mountingsurface of the circuit board 11 and the groove 47-1 of the first-stagesemiconductor chip 12-1, between the main surface of the first-stagesemiconductor chip 12-1 and the groove 47-2 of the second-stagesemiconductor chip 12-2 and between the main surface of the second-stagesemiconductor chip 12-2 and the groove 47-3 of the third-stagesemiconductor chip 12-3 are respectively filled with insulating members57-1, 57-2, 57-3 in the structure shown in FIG. 167.

[A Modification 19 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 169, overhung portions 17 are formed alongthe two or four opposite sides of the chip and grooves 47 are formed inthe central portion thereof. Through electrodes 55-1, 55-2, 55-3 areformed in positions corresponding to the overhung portions 17 andgrooves 47 and the chips are mounted on the circuit board 11 with platedbumps 41-1, 41-2, 41-3 disposed therebetween, respectively. The grooves47 can be formed in desired positions corresponding to positions inwhich the plated bumps 41-1, 41-2, 41-3 of the lower-stage semiconductorchips are formed.

The overhung portions 17 and grooves 47 have different radii ofcurvature and different depths. The radii of curvature and depths of theoverhung portions 17 and grooves 47 are set according to the thicknessof the plated bumps 41-1, 41-2, 41-3 and the height of the throughelectrodes 55-1, 55-2, 55-3 of the lower-stage semiconductor chips, forexample.

The other basic structures are the same as those shown in FIG. 155, andtherefore, the same portions are denoted by the same reference symbolsand the detail explanation thereof is omitted.

[A Modification 20 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 170, spaces formed between the chip mountingsurface of the circuit board 11 and the overhung portions and grooves ofthe first-stage semiconductor chip 12-1, between the main surface of thefirst-stage semiconductor chip 12-1 and the overhung portions andgrooves of the second-stage semiconductor chip 12-2 and between the mainsurface of the second-stage semiconductor chip 12-2 and the overhungportions and grooves of the third-stage semiconductor chip 12-3 arerespectively filled with insulating members 57-1, 57-2, 57-3 in thestructure shown in FIG. 169.

The other basic structures are the same as those shown in FIG. 169 andthe radii of curvature and depths of the overhung portions 17 andgrooves 47 and the arrangement of the grooves 47 can be freely setaccording to the thickness of the plated bumps 41-1, 41-2, 41-3 and theheight of the through electrodes 55-1, 55-2, 55-3 of the lower-stagesemiconductor chips, positions in which the plated bumps 41-1, 41-2,41-3 of the lower-stage semiconductor chips are formed and the like.

[A Modification 21 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 171, various chips in which the formingpositions of overhung portions and grooves are different are stacked.Circuit boards 40-1, 40-2 are respectively disposed between the mainsurface of the first-stage semiconductor chip 12-1 and the backside ofthe second-stage semiconductor chip 12-2 and between the main surface ofthe second-stage semiconductor chip 12-2 and the backside of thethird-stage semiconductor chip 12-3. Further, the through electrodes55-1 of the chip 12-1 are connected to the through electrodes 55-2 ofthe chip 12-2 via ball bumps 42-2 and printed wirings formed on thecircuit board 40-1 and the through electrodes 55-2 of the chip 12-2 areconnected to the through electrodes 55-3 of the chip 12-3 via ball bumps42-3 and printed wirings formed on the circuit board 40-2.

Of course, the same operation and effect can be attained by using asemiconductor chip having the front and backsides on which wirings aremade by use of a re-wiring process or wired spacers instead of thecircuit boards 40-1, 40-2.

Further, the radii of curvature and depths of the overhung portions 17and grooves 47 and the arrangement of the grooves 47 can be freely setaccording to the thickness of the plated bumps 41-1, 41-2, 41-3 and theheight of the through electrodes 55-1, 55-2, 55-3 of the lower-stagesemiconductor chips, positions in which the plated bumps 41-1, 41-2,41-3 of the lower-stage semiconductor chips are formed and the like.

[A Modification 22 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In an example shown in FIG. 172, the chips are stacked without usingDAFs by respectively disposing insulating members 57-1, 57-2, 57-3between the chip mounting surface of the circuit board 11 and thebackside of the first-stage semiconductor chip 12-1, between the circuitboard 40-1 and the backside of the second-stage semiconductor chip 12-2and between the circuit board 40-2 and the backside of the third-stagesemiconductor chip 12-3 in the structure shown in FIG. 171. Further,spaces formed between the chip mounting surface of the circuit board 11and the grooves of the first-stage semiconductor chip 12-1, between thecircuit board 40-1 and the overhung portions of the second-stagesemiconductor chip 12-2 and between the circuit board 40-2 and theoverhung portions and groove of the third-stage semiconductor chip 12-3are respectively filled with the insulating members 57-1, 57-2, 57-3.

Like the modification 21, in the modification 22, a semiconductor chiphaving the front and backsides on which re-wirings are made by use of are-wiring process or wired spacers can be used instead of the circuitboards 40-1, 40-2.

[A Modification 23 of the Stacked Structure of the Semiconductor Chipsin the Second Embodiment]

In the second embodiment and the modifications 1 to 22, a case whereinthe DAF has substantially the same size as the bottom surface of thesemiconductor chip is shown. However, if the semiconductor chips areformed by the manufacturing steps shown in FIGS. 127A, 127B to 134A,134B, for example, the size of the DAF becomes equal to the size of themain surface of each semiconductor chip.

Even if the chips to which the DAFs each having the same size as themain surface of the semiconductor chip are attached are stacked in thesame manner as in the second embodiment and the modifications 1 to 22thereof, substantially the same operation and effect can be attained.

Next, modifications of the manufacturing process are explained withreference to FIGS. 173A, 173B to 179A, 179B.

[A Modification 1 of the Manufacturing Process in the Second Embodiment]

FIGS. 173A, 173B to FIGS. 179A, 179B illustrate another manufacturingprocess of the COC package type semiconductor device, FIGS. 173A to 179Aare perspective views and FIGS. 173B to 179B are cross sectional viewsof FIGS. 173A to 179A.

First, semiconductor elements are formed on the main surface of thesemiconductor wafer and then through electrodes electrically connectedto the semiconductor elements are formed by a known manufacturingprocess. The through electrodes can be formed to penetrate through thesemiconductor wafer, but if they are formed to shallow depth so as to beexposed in the later backside grinding step, they can be easily formedand the manufacturing cost can be lowered.

Next, as shown in FIGS. 173A, 173B, first grooves 22-1, 22-2, 22-3, . .. are formed along dicing lines or chip dividing lines in the mainsurface of the semiconductor wafer 20 by use of a diamond blade 21 orthe like (half-cut dicing).

Next, as shown in FIGS. 174A, 174B, a BSG tape (surface protection tape)23 is attached to the main surface (element forming surface) of thesemiconductor wafer 20 and second grooves 25-1, 25-2, . . . used to formthe overhung portions are formed along the dicing lines or chip dividinglines in the backside of the semiconductor wafer 20 by use of a diamondblade 24. The second grooves 25-1, 25-2, . . . are formed in positionscorresponding to the two opposite sides of each semiconductor chip 12 asshown in FIGS. 135A, 135B or formed in positions corresponding to thefour opposite sides of each semiconductor chip 12 as shown in FIGS.144A, 144B. In the case of FIGS. 174A, 174B, an example in which thegrooves are formed in positions corresponding to the four opposite sidesis shown. The second grooves 25-1, 25-2, . . . are formed in positionson the backside corresponding to connection electrodes between adjacentsemiconductor chips to have openings which are wider than regionsbetween the connection electrodes of the adjacent semiconductor chipsand are formed to depth to reach at least the first grooves 22-1, 22-2,22-3 . . . .

Next, as shown in FIGS. 175A, 175B, the backside of the semiconductorwafer is ground by use of a grinding stone 26 or the like so as tofinish the wafer to desired thickness. As a result, the semiconductorwafer 20 is discretely divided to form semiconductor chips 12, 12, . . ..

Next, as shown in FIGS. 176A, 176B, the backside of the semiconductorwafer 20 (discretely divided semiconductor chips 12, 12, . . . ) issubjected to a plasma etching, wet etching or CMP process and thus thethrough electrodes 55 are protruded from the backside. In FIGS. 176A,176B, the working process by a polishing device 38 for the CMP processis shown as a representative.

After this, as shown in FIGS. 177A, 177B, the semiconductor wafer 20 isplaced on a stage 31, a dicing tape 28 is attached to the backside byuse of a roller 29 or the like and thus the semiconductor wafer ismounted on a wafer ring 30.

Next, as shown in FIGS. 178A, 178B, the surface protection tape 23 isseparated.

Then, as shown in FIGS. 179A, 179B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be brought into direct contact with the backside of the chip12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, the pickup needles 33 are brought intocontact with the thick portions of the chip 12 and pushed upward toseparate the chip from the dicing tape 28. The chip is fed with the chipsurface attracted by a collet 34.

Next, the chips 12 thus fed by the collet 34 are sequentially stacked ona circuit board 11 having external connection electrodes 14-1, 14-2, . .. by die bonding and mounted thereon with connection electrodes such asstud bumps, through electrodes or ball bumps disposed therebetween. Whenthe chips are mounted, the chips are stacked so as to set the overhungportions in positions corresponding to the connection electrodes formedon the circuit board 11 or the connection electrodes formed on thethrough electrodes of the semiconductor chip arranged in the lowerstage. Thus, spaces to accommodate the through electrodes are formedbetween the overhung portions and the surface of the circuit board 11 orthe main surface of the chip 12 arranged in the lower stage. When thechip 12 is die-bonded, connection between the connection electrodes canbe made stronger by application of ultrasonic waves.

Then, the stacked semiconductor chips, connection electrodes and thechip mounting surface of the circuit board 11 are covered with resinmold or the like to form a package 10.

[A Modification 2 of the Manufacturing Process in the Second Embodiment]

FIGS. 180A, 180B to FIGS. 187A, 187B illustrate still anothermanufacturing process of the COC package type semiconductor device,FIGS. 180A to 187A are perspective views and FIGS. 180B to 187B arecross sectional views of FIGS. 180A to 187A.

First, semiconductor elements are formed on the main surface of thesemiconductor wafer and then through electrodes electrically connectedto the semiconductor elements are formed by a known manufacturingprocess. The through electrodes can be formed to penetrate through thesemiconductor wafer, but if they are formed to shallow depth so as to beexposed in the later backside grinding step, they can be easily formedand the manufacturing cost can be lowered.

Next, as shown in FIGS. 180A, 180B, first grooves 22-1, 22-2, 22-3, . .. are formed along dicing lines or chip dividing lines in the mainsurface of the semiconductor wafer 20 by use of a diamond blade 21 orthe like (half-cut dicing). The depth of the first grooves 22-1, 22-2,22-3, . . . is made smaller than the thickness of the finally obtainedchips.

After this, as shown in FIGS. 181A, 181B, a BSG tape (surface protectiontape) 23 is attached to the main surface (element forming surface) ofthe semiconductor wafer 20 and the backside of the wafer is ground so asto finish the wafer to desired thickness by use of a grinding stone 26or the like. At this time, the backside of the wafer is so ground thatthe ground surface will not reach the first grooves 22-1, 22-2, 22-3, .. . .

Then, as shown in FIGS. 182A, 182B, the backside of the semiconductorwafer 20 is subjected to a plasma etching, wet etching or CMP processand thus the through electrodes 55 are protruded from the backside ofthe wafer. In FIGS. 182A, 182B, the working process by a polishingdevice 38 for the CMP process is shown as a representative.

Next, as shown in FIGS. 183A, 183B, the semiconductor wafer 20 is placedon a stage 31 and a DAF 27 is attached to the backside by use of aroller 29 or the like.

After this, as shown in FIGS. 184A, 184B, second grooves 25-1, 25-2, . .. used to form the overhung portions are formed along the dicing linesor chip dividing lines in the backside of the semiconductor wafer 20 byuse of a diamond blade 24. At this time, the DAF 27 is also cut apartfor each chip. The second grooves 25-1, 25-2, . . . are formed inpositions corresponding to the two opposite sides of each semiconductorchip 12 as shown in FIGS. 135A, 135B or formed in positionscorresponding to the four opposite sides of each semiconductor chip 12as shown in FIGS. 144A, 144B. In the case of FIGS. 184A, 184B, anexample in which the grooves are formed in positions corresponding tothe four opposite sides is shown. The second grooves 25-1, 25-2, . . .are formed in positions on the backside corresponding to connectionelectrodes between adjacent semiconductor chips to have openings whichare wider than regions between the connection electrodes of the adjacentsemiconductor chips and are formed to depth to reach at least the firstgrooves 22-1, 22-2, 22-3 . . . . Thus, the semiconductor wafer 20 isdiscretely divided to form semiconductor chips 12, 12, . . . .

Next, as shown in FIGS. 185A, 185B, the semiconductor wafer 20 is placedon a stage 31, a dicing tape 28 is attached to the backside by use of aroller 29 or the like and thus the semiconductor wafer is mounted on awafer ring 30.

Next, as shown in FIGS. 186A, 186B, the surface protection tape 23 isseparated.

Then, as shown in FIGS. 187A, 187B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be brought into direct contact with the backside of the chip12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, the pickup needles 33 are brought intocontact with the thick portions of the chip 12 and pushed upward toseparate the chip from the dicing tape 28. The separated chip is fedwith the chip surface attracted by a collet 34.

Next, the chips 12 thus fed by the collet 34 are sequentially stacked ona circuit board 11 having external connection electrodes 14-1, 14-2, . .. by die bonding and mounted thereon with connection electrodes such asstud bumps, through electrodes or ball bumps disposed therebetween. Whenthe chips are mounted, the chips are stacked so as to set the overhungportions in positions corresponding to the connection electrodes formedon the circuit board 11 or the connection electrodes formed on thethrough electrodes of the semiconductor chip arranged in the lowerstage. Thus, spaces to accommodate the through electrodes are formedbetween the overhung portions and the surface of the circuit board 11 orthe main surface of the chip 12 arranged in the lower stage. When thechip 12 is die-bonded, connection between the connection electrodes canbe made stronger by application of ultrasonic waves.

Then, the stacked semiconductor chips, connection electrodes and thechip mounting surface of the circuit board 11 are covered with resinmold or the like to form a package 10.

[A Modification 3 of the Manufacturing Process in the Second Embodiment]

FIGS. 188A, 188B to FIGS. 195A, 195B illustrate still anothermanufacturing process of the COC package type semiconductor device,FIGS. 188A to 195A are perspective views and FIGS. 188B to 195B arecross sectional views of FIGS. 188A to 195A.

First, semiconductor elements are formed on the main surface of thesemiconductor wafer and then through electrodes electrically connectedto the semiconductor elements are formed by a known manufacturingprocess. The through electrodes can be formed to penetrate through thesemiconductor wafer, but if they are formed to shallow depth so as to beexposed in the later backside grinding step, they can be easily formedand the manufacturing cost can be lowered.

Next, as shown in FIGS. 188A, 188B, first grooves 22-1, 22-2, 22-3, . .. are formed along dicing lines or chip dividing lines in the mainsurface of the semiconductor wafer 20 by use of a diamond blade 21 orthe like (half-cut dicing). The depth of the first grooves 22-1, 22-2,22-3, . . . is made smaller than the thickness of the finally obtainedchips.

After this, as shown in FIGS. 189A, 189B, a BSG tape (surface protectiontape) 23 is attached to the main surface (element forming surface) ofthe semiconductor wafer 20 and the backside thereof is ground to finishthe wafer to desired thickness by use of a grinding stone 26 or thelike. At this time, the backside of the wafer is ground so that theground surface will not reach the first grooves 22-1, 22-2, 22-3, . . ..

Then, as shown in FIGS. 190A, 190B, the semiconductor wafer 20 is placedon a stage 31 and a DAF 27 is affixed to the backside thereof by use ofa roller 29 or the like.

Next, as shown in FIGS. 191A, 191B, second grooves 25-1, 25-2, . . .used to form the overhung portions are formed along the dicing lines orchip dividing lines in the backside of the semiconductor wafer 20 by useof a diamond blade 24. At this time, the DAF 27 is also cut apart foreach chip. The second grooves 25-1, 25-2, . . . are formed in positionscorresponding to the two opposite sides of each semiconductor chip 12 asshown in FIGS. 135A, 135B or formed in positions corresponding to thefour opposite sides of each semiconductor chip 12 as shown in FIGS.144A, 144B. In the case of FIGS. 191A, 191B, an example in which thegrooves are formed in positions corresponding to the four opposite sidesis shown. The second grooves 25-1, 25-2, . . . are formed in position onthe backside corresponding to connection electrodes between adjacentsemiconductor chips to have openings which are wider than regionsbetween the connection electrodes of the adjacent semiconductor chipsand are formed to depth to reach at least the first grooves 22-1, 22-2,22-3 . . . . Thus, the semiconductor wafer 20 is discretely divided toform semiconductor chips 12, 12, . . . .

After this, as shown in FIGS. 192A, 192B, the backside of thesemiconductor wafer 20 is subjected to a plasma etching, wet etching orCMP process to remove working distortions such as grinding distortionsor grinding scratches by etching the side walls of the second grooves25-1, 25-2, . . . and protrude the through electrodes 55 from thebackside of the wafer. In FIGS. 192A, 192B, the working process by theplasma etching process is shown as a representative. When the plasmaetching or wet etching process is performed, a material which is notmelted or removed by the etching process, for example, a dry film orresist film is used as the DAF 27.

Next, as shown in FIGS. 193A, 193B, the semiconductor wafer 20 is placedon a stage 31, a dicing tape 28 is attached to the backside thereof byuse of a roller 29 or the like and thus the semiconductor wafer ismounted on a wafer ring 30.

Next, as shown in FIGS. 194A, 194B, the surface protection tape 23 isseparated.

Then, as shown in FIGS. 195A, 195B, the chips (good chips) are separatedfrom the dicing tape 28 and picked up for each chip. In the pickup step,the backside of the dicing tape 28 is pushed up for each chip 12 by useof pickup needles 33 and the needles penetrate through the dicing tape28 so as to be brought into direct contact with the backside of the chip12 and are further pushed upwardly to separate the chip 12 from thedicing tape 28. At this time, the pickup needles 33 are brought intocontact with the thick portions of the chip 12 and pushed upward toseparate the chip from the dicing tape 28. The separated chip is fedwith the chip surface attracted by a collet 34.

Next, the chips 12 thus fed by the collet 34 are sequentially stacked ona circuit board 11 having external connection electrodes 14-1, 14-2, . .. by die bonding and mounted thereon with connection electrodes such asstud bumps, through electrodes or ball bumps disposed therebetween. Whenthe chips are mounted, the chips are stacked so as to set the overhungportions in positions corresponding to the connection electrodes formedon the circuit board 11 or the connection electrodes formed on thethrough electrodes of the semiconductor chip arranged in the lowerstage. Thus, spaces to accommodate the through electrodes are formedbetween the overhung portions and the surface of the circuit board 11 orthe main surface of the chip 12 arranged in the lower stage. When thechip 12 is die-bonded, connection between the connection electrodes canbe made stronger by application of ultrasonic waves.

Then, the stacked semiconductor chips, connection electrodes and thechip mounting surface of the circuit board 11 are covered with resinmold or the like to form a package 10.

[A Modification 4 of the Manufacturing Process in the Second Embodiment]

In the second embodiment, grooves 25-1, 25-2, . . . may be formed in thebackside of the semiconductor wafer 20 before the half-cutting process.After this, the backside may be ground and etched, a dicing tape 28 maybe attached to the backside of the semiconductor chip 20 and thesemiconductor wafer can be diced from the main surface to form chips 12.

[A Modification 5 of the Manufacturing Process in the Second Embodiment]

In the second embodiment and the modifications thereof, a blade systemis used when the first and second grooves are formed, but it is possibleto use a laser system (grooves and the improvement of the interiorquality), cutter, etching (RIE, for example) process or wire scribingprocess, for example, and a combination of a plurality of methods can beused.

[A Modification 6 of the Manufacturing Process in the Second Embodiment]

As the DAF in the second embodiment and the modifications thereof,polyimide-series or epoxy-series resin can be used. Further, a materialof a component which is not etched can be used.

[A Modification 7 of the Manufacturing Process in the Second Embodiment]

A case wherein the DAF is cut apart by use of the blade system is shownas an example, but the DAF can be cut apart by use of a laser system(grooves and the improvement of the interior quality), cutter, etchingprocess or wire scribing process.

[A Modification 8 of the Manufacturing Process in the Second Embodiment]

A case wherein the pickup step is performed by use of the pin system isexplained, but various systems such as the pinless system, ultrasonicwave system and tapeless system can be used.

[A Modification 9 of the Manufacturing Process in the Second Embodiment]

The wire bonding system can be applied to either the positive bonding(including the reverse bonding like positive bonding) or the reversebonding.

[A Modification 10 of the Manufacturing Process in the SecondEmbodiment]

The sealing step into the package 10 is not limited to the mold (resinsealing) system, but a film sealing system or a potting system ofdropping liquid resin and sealing can be applied.

Next, various manufacturing methods for filling spaces with insulatingmembers or adhering chips by use of insulating members and fillingspaces with the insulating members are explained with reference to FIGS.196A, 196B to 200A, 200B.

An Example 1 of the Process of Filling Spaces with Insulating Members

FIGS. 196A, 196B show an example of the process of filling spaces underthe overhung portions with insulating members. The process shown inFIGS. 196A, 196B is to mount a chip by use of a DAF and fill spaces withinsulating members and shows a state in which a first-stage chip 12-1 ismounted on a circuit board 11. An insulating material such as aninsulating bonding agent or sealing resin is supplied from a dispensernozzle 36 onto connection electrodes (in this example, ball bumps 42-2are shown as an example) of the chip 12-1. A semiconductor chip 12-2formed in the above process is stacked and mounted on the chip 12-1 witha DAF disposed therebetween. When the chip 12-2 is stacked and mountedon the chip 12-1, the overhung portions thereof are set to correspond inposition to the ball bumps 42-2 of the chip 12-1 arranged in the lowerstage. Thus, spaces formed between the main surface of the chip 12-1arranged in the lower stage and the overhung portions of the chip 12-2to be stacked are filled with insulating members 57-2.

An Example 2 of the Process of Filling Spaces with Insulating Members

In the example 1 of the process, the insulating member 57-1 is suppliedto a region in which the ball bumps and through electrodes formed on thetwo opposite sides of the chip 12-1 are formed. However, when the ballbumps and through electrodes are formed along the four sides of the chip12-2, an insulating member 57-2 is formed along the four sides as shownin FIGS. 197A, 197B.

Of course, it is possible to form the insulating member along the foursides of the chip when the through electrodes and ball bumps are formedonly on the two sides of the chip.

An Example 3 of the Process of Filling Spaces with Insulating Members

As shown in FIGS. 198A, 198B, an insulating member such as resin may bedropped from a dispenser nozzle 36 onto the chip 12-1. The manufacturingmethod is adequately applied to the structure in which the chips arestacked and mounted without using DAFs. When the chip 12-2 is mounted onthe chip 12-1, spaces are filled with the insulating member 57-2 pushedout from under the backside of the chip 12-2 to the peripheral portionthereof.

An example 4 of the Process of Filling Spaces with Insulating Members

As shown in FIGS. 199A, 199B, an insulating member 57-2 such as resinmay be caused to flow out from a dispenser nozzle 36 onto the chip 12-1and may be coated to cover the surface of the chip 12-1. Also, themanufacturing method is adequately applied to the structure in which thechips are stacked and mounted without using DAFs. When the chip 12-2 ismounted on the chip 12-1, spaces are filled with the insulating member57-2 pushed out from under the backside of the chip 12-2 to theperipheral portion thereof.

An Example 5 of the Process of Filling Spaces with Insulating Members

As shown in FIG. 200A, an insulating member such as resin can be formedon the overhung portions of the chip 12-2, and as shown in FIG. 200B,spaces can be filled with the insulating member when the chip 12-2 ismounted.

An example 6 of the Process of Filling Voids with Insulating Members

In the examples 1 to 5 of the process, a one-point nozzle system isexplained, but a multi-point nozzle system, a system for scanning by useof the one-point nozzle system (a single stroke of the nozzle) can beused. Further, the chip can be dipped into a tray in which resin iscontained so as to adhere the resin to the backside of the chip. Inaddition, a transfer system can be used and various combinations of thetransfer systems of transfer to the central portion of the main surfaceof the lower-stage chip, transfer onto the connection electrodes andtransfer onto the chip central portion and connection electrodes can beused.

An example 7 of the Process of Filling Spaces with Insulating Members

As the insulating member, various types of insulating materials such asa DAF material (die attach film), insulating paste, under-fill material,liquid resin, potting resin, B-stage resin (epoxy-series) and the likecan be used.

Therefore, with the structures according to the second embodiment ofthis invention and the modifications thereof, the package can be madethin since the connection electrodes are accommodated into theaccommodating portions formed by the overhung portions and grooves ofthe semiconductor chip and the chips are stacked in a multi-layeredform. If the package thickness is kept unchanged, the number of stackedstages of the chips can be increased.

According to the manufacturing method of the second embodiment of thisinvention and the modifications thereof, occurrence of chippings can bereduced since the semiconductor wafer is discretely divided by grindingthe backside. Further, since the thickness of the central portion of thechip can be increased, the warping amount of the chip can be reduced andit becomes easy to deal with the chip. In addition, occurrence of arecognition error at the time of position detection performed by usingan optical system such as a TV camera can be reduced. Also, occurrenceof chip cracks at the pickup time can be suppressed and formation ofvoids at the die-bonding time can be suppressed. As a result, themanufacturing cost can be lowered and the productivity can be enhanced.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. A manufacturing method of a semiconductor device comprising: formingsemiconductor elements and bonding wires electrically connected to thesemiconductor elements on a main surface of a semiconductor wafer,forming grooves having opening portions wider than regions betweenbonding pads of adjacent ones of the semiconductor chips on a backsidein positions corresponding to the bonding pads between the adjacentsemiconductor chips along one of dicing lines and chip dividing lines ofthe semiconductor wafer, forming insulating films in the grooves,dividing the semiconductor wafer along one of the dicing lines and chipdividing lines of the semiconductor wafer to form semiconductor chipshaving overhung portions each formed to have a start point inside thebonding pads and become thin in a direction toward an outer periphery toan end point which reaches a side wall thereof and used to form spaceswhich accommodate ball bonding portions between the overhung portionsand a main surface of a semiconductor chip arranged in a lower stage byusing the inner wall of the groove on at least one side of the outerperiphery, and stacking and mounting a plurality of semiconductor chipsincluding the semiconductor chip having the overhung portion formedwhile the overhung portion is set to correspond to the ball bondingportions of the semiconductor chip arranged in a lower stage andwire-bonding printed wirings on the circuit board with bonding padsformed on a main surface of the semiconductor chip each time thesemiconductor chip is mounted.
 2. The manufacturing method of thesemiconductor device according to claim 1, wherein the forming thegroove includes forming one of a curved surface with the radius ofcurvature of 0.05 mm to 2.5 mm, a compound surface having a plane and acurved surface with the radius of curvature of 0.01 mm to 2.5 mm, aplane having a constant inclination angle in a direction towards thethrough electrodes and a compound plane having planes whose inclinationangles are made smaller in a direction towards the through electrodes ona backside of the semiconductor chip.
 3. The manufacturing method of thesemiconductor device according to claim 1, further comprising etchinginternal portions of the grooves to eliminate distortion therein afterthe forming the grooves and before the forming the insulating members inthe grooves.
 4. A manufacturing method of a semiconductor devicecomprising: forming semiconductor elements and through electrodeselectrically connected to the semiconductor elements on a main surfaceof a semiconductor wafer, forming grooves having opening portions widerthan the through electrodes in positions corresponding to the throughelectrodes on a backside of the semiconductor wafer, dividing thesemiconductor wafer along one of dicing lines and chip dividing lines ofthe semiconductor wafer to form semiconductor chips having one ofoverhung portions and grooves which form accommodating portions toaccommodate connection electrodes between one of the overhung portionsand grooves and one of a chip mounting surface of a circuit board havingexternal connection electrodes and a main surface of a semiconductorchip arranged in a lower stage, and mounting the plurality ofsemiconductor chips thus formed by arranging one of the overhungportions and grooves of the plurality of semiconductor chips to face oneof electrode pads of the circuit board and the through electrodes of thesemiconductor chip arranged in the lower stage and making electricalconnections between the electrode pads and the through electrodes of thesemiconductor chips and between the through electrodes of thesemiconductor chips via the connection electrodes.
 5. The manufacturingmethod of the semiconductor device according to claim 4, wherein theforming the through electrodes includes forming through holes whichpenetrate through the respective semiconductor chips, forming insulatinglayers in the through holes, and forming the through electrodes in thethrough holes with the insulating layers disposed therebetween.
 6. Themanufacturing method of the semiconductor device according to claim 4,wherein the forming the grooves includes forming one of a curved surfacewith a radius of curvature of 0.05 mm to 2.5 mm, a compound surface of aplane and a curved surface with a radius of curvature of 0.01 mm to 2.5mm, a plane having a constant inclination angle towards the throughelectrode, and a compound plane having planes whose inclination anglesare made smaller towards the through electrode on a backside of thesemiconductor chip.
 7. The manufacturing method of the semiconductordevice according to claim 4, further comprising etching internalportions of the grooves to eliminate distortion therein after theforming the grooves and before the forming the insulating members in thegrooves.
 8. The manufacturing method of the semiconductor deviceaccording to claim 4, wherein the mounting the semiconductor chips isperformed while the semiconductor chips are set in one of athermocompressed state and ultrasonic wave application state.